WMSIC Electronic Components

muRata GRM188R6YA475KE15D

ModelGRM188R6YA475KE15D
Package0603
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM188R6YA475KE15D
Type
MURATA
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM188R6YA475KE15D
Electronic Component
1
Electronic Component
4.7uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0128477191
Electronic Component
X5R
Voltage
35V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM188R6YA475KE15D 贴片电容

概述

GRM188R6YA475KE15D 是由日本村田(μRata)公司制造的一款高品质多层陶瓷电容器(MLCC),其主要特点是具有规格为4.7µF、额定电压35V的优良电气性能。该电容器在电子电路中具有广泛的应用,可以满足各种高频和一般电源电路的要求,特别适用于现代微型电子设备。

主要参数

  1. 电容量: 4.7µF
  2. 电压额定值: 35V
  3. 容差: ±10%
  4. 温度系数: X5R
  5. 工作温度范围: -55°C至85°C
  6. 安装类型: 表面贴装
  7. 封装/外壳: 0603 (1608 公制)
  8. 尺寸: 1.60mm × 0.80mm
  9. 厚度(最大值): 0.80mm

技术特点

GRM188R6YA475KE15D 采用 X5R 温度系数,这意味着电容在-55°C到85°C的工作温度范围内,电容值变化小于±15%。这种特性使得该电容器在宽温度范围内可以维持稳定的电气性能,非常适用于高稳定性要求的电路设计。

此外,该电容器的额定电压为35V,能够适应中等电压的应用需求,是在大多数电源管理和信号处理电路中都可安全使用的选项。

应用场景

GRM188R6YA475KE15D 适用于多种电子应用,如:

  • 通用去耦: 在电源线与地之间以控制噪声,提升电源稳定性。
  • 滤波: 在信号处理中的高频滤波电路中,用于去除不必要的频率干扰。
  • 高频电路: 在RF(射频)和高速信号线中提供良好的电气性能,确保信号完整性。
  • 电源管理: 在DC-DC转换器和开关电源中用于平滑电压和电流波动。

安装与集成

GRM188R6YA475KE15D 采用0603(1608公制)的封装尺寸,适合于表面贴装技术(SMT),便于在现代自动化生产环境中的快速组装与焊接。在面积受限的应用中,0603封装的产品因其小型化特性,可以有效节省PCB空间。

同时,陶瓷电容器的低ESR(等效串联电阻)特性也使得该电容器在大电流情况下能够更好地发挥作用,减少发热,提高效率。

材料安全

作为村田公司的产品,GRM188R6YA475KE15D 符合多项国际电子产品环保标准,包括RoHS指令,确保在安全、环保的前提下广泛应用。

总结

GRM188R6YA475KE15D 以其优异的电气性能、宽广的工作温度范围和小巧的0603封装,成为电容市场上的一款理想选择。无论是在移动设备、消费类电子产品还是工业应用中,均能提供稳定的性能,广泛适用于各类电子电路设计。选择此款电容器,将为您的项目提供更多的设计灵活性与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.