WMSIC Electronic Components

muRata BLM15AG221SN1D

muRata BLM15AG221SN1D
1 / 2

Product image

ModelBLM15AG221SN1D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
mu Rata BLM15AG221SN1D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
BLM15AG221SN1D
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.015g
Electronic Component
1
Channel Count
1
Electronic Component
BM0051186426
Current
450mA
@Frequency
220Ω@100MHz
Resistor(DCR)
290mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：BLM15AG221SN1D 磁珠

概述

BLM15AG221SN1D 是一款由知名电子元器件制造商村田（muRata）生产的高性能磁珠。该磁珠具备卓越的电气特性，特别适合在各种电子设备中用于信号干扰抑制和电源过滤。这款磁珠采用0402封装（即1.0mm x 0.5mm），是一种小型化设计，非常适合现代紧凑型电子产品。

基本参数

  • 线路数：BLM15AG221SN1D 具有单一线路，适应广泛的使用场景。
  • 阻抗特性：在100MHz频率下，该磁珠的阻抗值为220Ω，使其能够有效抑制高频噪声，保证信号的完整性和稳定性。
  • 额定电流：其最大额定电流为450mA，这使得该磁珠能够在相对较高的电流环境中可靠工作而不会发生性能下降。
  • 直流电阻（DCR）：最大值为290mΩ，这一低阻抗特性能够确保在工作状态下最大限度地减少功率损耗。
  • 工作温度范围：该器件能够在极端温度条件下运行，工作温度范围为-55°C至125°C，适用于各种应用环境。
  • 封装/外壳：0402封装的设计使得该磁珠在表面贴装技术（SMT）应用中表现出色，便于与其他元器件集成。

应用场景

BLM15AG221SN1D 磁珠广泛用于以下领域：

  1. 消费电子：可用于手机、平板电脑、笔记本电脑等设备，帮助降低电磁干扰（EMI），改善信号质量。
  2. 工业设备：在工业控制系统中，用于滤除电源及信号线路上的高频噪声，确保设备的稳定运行。
  3. 汽车电子：随着汽车电子化程度的不断提高，该磁珠也可用于汽车音响系统、导航系统以及其他电子控制模块，提升系统可靠性和信号清晰度。
  4. 通信设备：可应用于基站、路由器和交换机等通信设备中，有效过滤噪声，提升数据传输的稳定性和安全性。

竞争优势

BLM15AG221SN1D 的设计不仅关注于性能，还考虑到使用的便利性和可靠性。在市场中，该产品相较于其他竞争产品具有以下优势：

  • 小型化设计：0402封装有助于在紧凑空间内进行更高密度的电路设计。
  • 高阻抗特性：在高频应用中提供卓越的信号过滤能力，减少信号干扰的风险。
  • 宽广的温度适用范围：能够承受极端环境条件，确保产品在各种应用中的稳定表现。

结论

BLM15AG221SN1D 是一款集高性能与高可靠于一身的磁珠，适用于各种电子应用，尤其是在需要抑制高频噪声和提升信号质量的场合。凭借其便捷的0402封装和出色的电气性能，该产品不仅提升了设计的灵活性，更为电子产品的整体性能提供了有力支持。无论是在消费电子、工业设备、汽车电子还是通信设备中，BLM15AG221SN1D 都是实现高效能与高可靠性的重要组件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.