Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata BLM15GG471SN1D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata BLM15GG471SN1D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- BLM15GG471SN1D
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0118549269
- Operating Temperature
- 55℃~+125℃
- Current
- 200mA
- @Frequency
- 470Ω@100MHz
- Resistor(DCR)
- 1.3Ω
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：BLM15GG471SN1D 磁珠
引言
BLM15GG471SN1D 是一款高性能的磁珠，由知名电子元器件制造商村田（muRata）生产。这款磁珠专为高频应用而设计，具有优异的阻抗特性和出色的电流处理能力，是现代电子设备中至关重要的电磁干扰（EMI）抑制解决方案之一。
基础参数
- 线路数：1
- 不同频率时阻抗：470 Ohms @ 100MHz
- 额定电流（最大）：200mA
- 直流电阻（DCR）最大值：1.3 Ohms
- 工作温度范围：-55°C ~ 125°C
- 封装/外壳：0402（1005公制）
- 安装类型：表面贴装型
- 最高高度：0.022"（0.55mm）
- 尺寸：0.039" 长 x 0.022" 宽（1.00mm x 0.55mm）
产品特点
BLM15GG471SN1D 磁珠具备多个显著特点，使其在众多应用中效率显著。首先，470Ω 的阻抗在 100MHz 的频率下，提供了良好的 EMI 抑制能力，有效减少电磁干扰，提升电路的稳定性与可靠性。此外，其最大额定电流可达 200mA，能够适应不同负载条件下的工作需求。
该磁珠的最大直流电阻为 1.3Ω，表明其在电流通过时会产生相对较低的功耗，从而降低热量的产生，延长电路组件的使用寿命。这一点对于要求高度集成且功耗敏感的现代电子设备尤为重要。
工作环境
BLM15GG471SN1D 的工作温度范围从 -55°C 到 125°C，适用于广泛的应用场景，包括汽车电子、工业设备及消费类电子产品等。这一范围确保了其在极端环境下仍能保持正常工作，大大增强了产品的适应性和应用广度。
封装与设计
该产品采用0402（1005公制）封装，尺寸仅为1.00mm x 0.55mm，这使其非常适合在空间有限的电路板上使用。此外，表面贴装的安装方式简化了生产流程，提高了生产效率，降低了组装成本，符合现代快速发展的电子产品生产需求。
应用场景
BLM15GG471SN1D 磁珠广泛应用于各种电子产品中，尤其是在以下领域：
- 消费类电子：如手机、平板电脑及笔记本电脑等，能够有效抑制内部电磁干扰，优化信号质量。
- 汽车电子：在电动汽车及先进驾驶辅助系统中，确保信号传输的可靠性与安全性。
- 工业设备：在PLC及工业自动化设备中，提升系统的稳定性，抵抗外部环境干扰。
- 通信设备：在高频信号处理器和射频模块中，改进信号完整性，促进高性能通信。
结论
总的来说，BLM15GG471SN1D 磁珠凭借其出色的技术参数和广泛的适用性，成为了电子工程师在设计和集成时的重要选择。无论是用于EMI抑制、信号优化，还是提升电路的稳定性，BLM15GG471SN1D 都能为您的电子产品提供强有力的支持。随着电子技术的不断进步和-miniaturization趋势的加剧，选择合适的磁珠是设计成功的关键之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
