Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata LQP03TN27NH02D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata LQP03TN27NH02D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- LQP03TN27NH02D
- Electronic Component
- 1
- Package
- 0201
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±3%
- Electronic Component
- 0.008g
- Inductor
- 27nH
- Electronic Component
- 1
- Factor
- 12@500MHz
- Electronic Component
- BM0221213518
- Current
- 140mA
- Frequency
- 2GHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LQP03TN27NH02D 产品概述
LQP03TN27NH02D 是一款由日本村田（muRata）公司生产的高性能厚膜贴片电感器，具有卓越的电感特性及小型化设计，适用于高频及高密度电子电路中。其规格参数使其成为现代无线通信、射频（RF）及数码电子设备中的理想选择。
制造与材料
该电感器采用无磁性磁芯材料，确保了其在高频应用中的性能稳定性。无磁性材料的使用减少了磁损耗，增强了器件在高频环境中的表现，使其能够在高达2GHz的自谐振频率下正常工作。此外，整个器件为厚膜结构，增大了其电感性能的稳定性并提升了工作的可靠性。
关键参数
LQP03TN27NH02D 的电感值为 27nH，具有 ±3% 的紧凑容差，这使其在多种电子应用中提供了高精度的电感效果。其额定电流为 140mA，可以满足各种中等功率设备的需求。DC 电阻（DCR）最大值为 2.3Ω，保证了其在实际工作中的电能损耗较小，从而提高了整体电路的能效。
在频率特性方面，该电感的 Q 值为 12（在 500MHz 测试条件下）。Q 值是衡量电感性能的重要指标，较高的 Q 值能够提供更好的信号保真度和更低的信号失真，适合高频信号处理应用。此外，该元件具有较高的自谐振频率（SRF）为 2GHz，进一步提高了其在射频应用中所需的稳定性。
工作环境
LQP03TN27NH02D 在-55°C 至 125°C 的广泛温度范围内工作，保证了在不同环境条件下的可靠性。由于其耐高温和低温的特性，使得该电感器可广泛应用于极端环境下的电子设备，如汽车电子、航天及工业自动化设备。
封装与安装
该器件采用标准0201（0603公制）封装，体积小巧，只有0.024” 长 x 0.012” 宽（0.60mm x 0.30mm），最大高度为 0.013”（0.33mm）。这种超小型设计非常适合现代电子设备对小型化和轻量化的需求。表面贴装型的安装方式，使得其在生产过程中易于自动化贴装，提高了制造效率。
应用领域
LQP03TN27NH02D 可广泛应用在高频的无线通信领域，如蜂窝、蓝牙和Wi-Fi等其他射频设备中。这款电感器在信号处理、滤波和匹配网络等多种电路中展示了出色的性能。此外，它也适合用于智能手机、平板电脑、便携式设备、电源管理电路和射频应用等领域。
总的来说，LQP03TN27NH02D 以其优越的性能、出色的温度特性和小巧的封装，成为射频及高频应用中不可或缺的元件之一，是电子设计工程师的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
