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muRata BLM03AX100SN1D
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata BLM03AX100SN1D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- BLM03AX100SN1D
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0230675525
- Operating Temperature
- 55℃~+125℃
- Current
- 1A
- @Frequency
- 10Ω@100MHz
- Resistor(DCR)
- 50mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
muRata (村田) BLM03AX100SN1D 产品概述
一、产品简介
BLM03AX100SN1D 是村田一款 0201 封装的 SMD 铁氧体磁珠，用于高频噪声抑制与 EMI 滤波。标称阻抗为 10Ω（@100MHz），误差 ±25%，直流电阻 (DCR) 极低，仅 0.05Ω，额定直流通过电流 1A，工作温度范围 -55℃ 至 +125℃。器件为单通道（单端）结构，适合对空间与寄生要求严格的轻薄电子产品。
二、主要参数（要点）
- 阻抗：10Ω @ 100MHz（±25%，即约 7.5Ω–12.5Ω）
- DCR：0.05Ω（50mΩ），直流压降小，适合电源线使用
- 额定电流：1A（连续通过能力）
- 封装：0201（超小型，适合高密度 PCB）
- 类型：Ferrite bead（有损耗型，吸收高频干扰）
- 工作温度：-55℃ ~ +125℃
三、工作原理与等效电路
铁氧体磁珠在高频下表现为阻抗（包含感抗与等效损耗电阻），用于衰减高频干扰能量并将其转换为热能。等效上可视为串联的阻抗，频率响应通常随频率上升而增大，至某点后因寄生电容出现共振并可能下降。标注的 100MHz 阻抗为测量基准值。
四、典型应用场景
- 电源去耦与电源线 EMI 抑制（智能手机、可穿戴、IoT 模块）
- 高速数字信号线的射频噪声隔离
- 无线通信设备的接地与天线附近 EMI 控制
- 工业与消费电子中对尺寸和直流损耗敏感的场合
五、封装与焊接建议
0201 尺寸对贴装精度要求高，建议使用适配的吸嘴与贴片机参数。焊接时遵循厂商数据手册及 IPC/JEDEC 回流温度规范；一般兼容无铅回流工艺（按实际数据手册确认峰值温度与回流曲线），避免超过推荐回流次数以免影响性能与可靠性。
六、布局与选型注意事项
- 优先将磁珠放置在噪声源与敏感电路之间，靠近噪声源端以提高抑制效果。
- 0201 大小限制了最大电流与散热能力，若电流接近或超过 1A，应选更大封装或并联元件。
- 与旁路电容配合使用时，可形成更宽带的 EMI 抑制网络；注意并联电容可能改变系统共振频率。
- 对温漂、老化与机械应力敏感的应用，请参照厂方寿命与可靠性数据。
七、可靠性与环境适应
器件额定温度范围宽，适合多种环境。常见为无铅 / RoHS 要求工艺兼容，但具体合规性与认证（如 AEC-Q200）请以厂方资料为准。最终设计应基于完整的数据手册与应用说明进行验证与测试。
总结：BLM03AX100SN1D 以其超小 0201 尺寸、低 DCR 与 100MHz 处 10Ω 的阻抗，适合对体积和直流损耗敏感且需高频噪声抑制的移动与消费电子设计。选型与布局时应兼顾电流能力、热管理与与旁路网络的相互作用；详细电气与可靠性参数请参阅村田官方数据手册。
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