WMSIC Electronic Components

muRata GRM033R60J475ME05D

ModelGRM033R60J475ME05D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

16 specifications

Core information

Product name
mu Rata GRM033R60J475ME05D
Type
MURATA
Minimum package
15000

Technical parameters

Electronic Component
MURATA
Electronic Component
GRM033R60J475ME05D
Electronic Component
1
Electronic Component
4.7uF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.009g
Electronic Component
1
Electronic Component
BM0226175946
Electronic Component
X5R
Voltage
6.3V
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM033R60J475ME05D 产品概述

概要

GRM033R60J475ME05D 是由村田制作所(muRata)生产的贴片电容(MLCC),属于其广泛的多层陶瓷电容产品系列。以下是对此产品的详细介绍。

基础参数

  • 商品分类: 贴片电容(MLCC)
  • 容值: 4.7 μF
  • 材质(温度系数): X5R
  • 精度: ±20%
  • 额定电压: 6.3 V
  • 封装尺寸: 0201(0.6 mm x 0.3 mm)

材质和温度特性

GRM033R60J475ME05D 使用 X5R 类别的陶瓷介质。X5R 是一种高稳定性的陶瓷材料,适用于广泛的温度范围。具体来说,X5R 材料在 -55°C 到 +85°C 的温度范围内,容值变化不超过 ±15%。这种特性使得该电容器在各种环境条件下保持稳定的性能,非常适合用于需要高可靠性的电子设备。

容值和精度

该电容器的容值为 4.7 μF,精度为 ±20%。这意味着实际容值可能在 3.76 μF 到 5.64 μF 之间。这是一种常见的容值精度,适用于大多数通用应用场景。如果您的设计要求更高的精度,可以考虑其他类型的电容器,但对于大多数情况,±20% 的精度是足够的。

额定电压

GRM033R60J475ME05D 的额定电压为 6.3 V。这意味着在正常操作条件下,不应超过此电压,以避免电容器损坏或失效。选择合适的额定电压非常重要,因为过高的电压会导致电容器失效或甚至爆炸。

封装尺寸

该电容器采用 0201 封装,这是一种非常小巧的尺寸(0.6 mm x 0.3 mm)。这种小尺寸使得它非常适合用于现代电子设备中的高密度布局设计,例如智能手机、平板电脑、穿戴设备等。

应用场景

GRM033R60J475ME05D 适用于各种电子设备中的多种应用,包括:

  • 滤波和耦合: 在信号处理和电源系统中,用于去除噪声和耦合信号。
  • 电源滤波: 用于稳定和过滤电源线路中的噪声。
  • 信号处理: 在音频和视频设备中,用于滤波和缓冲信号。
  • 嵌入式系统: 适用于需要紧凑设计的嵌入式系统,如工业控制器、医疗设备等。

品牌和质量保证

村田制作所(muRata)是一家全球知名的电子元器件制造商,享有良好的声誉。其产品通过严格的质量控制和测试过程,以确保其可靠性和性能。选择村田的产品,可以确保您获得高质量和可靠性的电子元器件。

总结

GRM033R60J475ME05D 是一种高性能、紧凑设计的贴片电容,适用于广泛的电子应用场景。其 X5R 材质、±20% 的精度和 6.3 V 的额定电压,使其成为许多工程师和设计师的首选。同时,其小尺寸(0201)使其特别适合现代电子设备中的高密度布局设计。如果您正在寻找一款可靠、性能优异且紧凑的电容器,GRM033R60J475ME05D 是一个理想的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.