WMSIC Electronic Components

muRata GRM188R71A225KE15D

ModelGRM188R71A225KE15D
Package0603
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM188R71A225KE15D
Type
MURATA
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM188R71A225KE15D
Electronic Component
1
Electronic Component
2.2uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0000285877
Electronic Component
X7R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM188R71A225KE15D 产品概述

产品简介

GRM188R71A225KE15D 是由村田(muRata)公司生产的一款表面贴装陶瓷电容(Multi-Layer Ceramic Capacitor, MLCC)。它的主要电气特性包括额定电压10V,电容值2.2µF,容差达到±10%。该电容采用 X7R 温度系数,能够在极端温度条件下保持较为稳定的电容值,非常适合各类电子电路设计。

基础参数

  1. 电容值:2.2µF

    • 电容值是决定电容器储存电荷能力的重要参数,该产品提供的2.2µF足以满足大多数滤波和耦合应用的需求。
  2. 电压额定值:10V

    • 该电容器允许的最大工作电压为10V,适合用于低电压至中等电压电路中。
  3. 容差:±10%

    • 容差指的是电容器实际电容值与其标称值之间的允许偏差,这个电容器的容差比较合适,适合对精度要求不极端严格的应用。
  4. 温度系数:X7R

    • X7R属于陶瓷电容的温度系数标准,表示电容器在-55°C至125°C的工作温度范围内,其电容值变化不超过±15%,提供了良好的温度稳定性。
  5. 工作温度范围:-55°C ~ 125°C

    • 该电容的宽广工作温度范围使其可以在极端环境中运行,适用于航空航天、汽车及工业领域。
  6. 安装类型:表面贴装(SMD)

    • 作为表面贴装元件,GRM188R71A225KE15D可以轻松集成到现代电子设备中,实现高密度安装,适合现代电子制造的需求。
  7. 封装/外壳:0603(1608公制)

    • 封装尺寸为0603(宽度0.80mm,长度1.60mm),这使得该电容在空间有限的电路板设计中极具适应性。
  8. 厚度(最大值):0.035"(0.90mm)

    • 该电容的厚度设计得相对较小,可以提高电子设备的便携性和轻量化设计。

应用领域

GRM188R71A225KE15D 陶瓷电容在许多应用场景中表现出色,特别适合以下领域:

  • 消费电子:例如智能手机、平板电脑和其他便携式设备,通常需要高性能的滤波和耦合电容器以提高信号质量和电源管理能力。
  • 通信设备:在无线基站、路由器及其他通信设施中,该电容可以有效抑制高频噪声,提高信号的稳定性。
  • 汽车电子:在汽车的电子控制单元、传感器和电动动力系统中,该电容器的温度稳定性使其在极端条件下依然表现良好。
  • 工业控制:适合用于自动化设备和工业控制系统中,确保设备在苛刻环境中的稳定运行。
  • 医疗设备:在医疗仪器中,对电容器的可靠性和稳定性有着严格的要求,该电容能够满足相关参数需求。

结论

GRM188R71A225KE15D 是一款高性能的表面贴装陶瓷电容,其出色的电气特性和耐环境性能使其成为多种应用中的理想选择。无论是用于消费电子、通信设备、汽车电子、工业控制还是医疗设备,该电容都能提供卓越的性能和可靠性。作为村田公司的品牌产品,它也代表着高质量的电子元件,能够帮助设计工程师实现更高效、更稳定的电路方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.