WMSIC Electronic Components

muRata BLM03PG330SN1D

ModelBLM03PG330SN1D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata BLM03PG330SN1D
Type
MURATA
Unit
Electronic Component
Minimum package
15000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
BLM03PG330SN1D
Electronic Component
1
Package
0201
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.008g
Electronic Component
1
Channel Count
1
Electronic Component
BM0058412886
Operating Temperature
55℃~+125℃
Current
750mA
@Frequency
33Ω@100MHz
Resistor(DCR)
90mΩ
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

muRata BLM03PG330SN1D 产品概述

一、概述

BLM03PG330SN1D 是村田(muRata)推出的超小型多层磁珠(ferrite bead),封装为 0201(公制尺寸极小)。该器件针对 PCB 上的电源与信号线 EMI 抑制与去耦应用,尺寸小、适配高密度板设计。典型标称阻抗为 33Ω(@100MHz),直流电阻仅 90 mΩ,额定通过电流 750 mA,工作温度范围 -55℃ 至 +125℃,阻抗公差 ±25%,为单通道器件。

二、主要性能亮点

  • 阻抗:33 Ω @ 100 MHz,适合射频附近与高速数字换位噪声抑制。
  • 低直流电阻(DCR):90 mΩ,可在保证滤波效果的同时减小电压降与功耗。
  • 额定电流:750 mA,适用于中低电流电源轨与单片机、SoC 供电旁路场合。
  • 温度与可靠性:工作温度 -55℃ ~ +125℃,适应工业级环境;典型阻抗公差 ±25%。
  • 尺寸优势:0201 封装适合超小型、高密度 PCB 布局,有利于体积受限的移动设备与便携终端设计。

三、典型应用场景

  • 电源线 EMI 抑制:作为输入或输出电源线的串联元件,抑制从开关电源或数字电路引入的高频噪声。
  • 接地与信号完整性配合:与旁路电容配合形成低频旁路、高频隔离的滤波结构。
  • 通信与射频模块:用于天线馈线前端或无线模块的共模/差模噪声管理(注意单通道器件仅用于单端线路)。
  • 消费类与移动设备、可穿戴、IoT 节点等对尺寸与 EMI 要求严格的产品。

四、设计与布局建议

  • 置于噪声源与敏感电路之间的最短路径上;对电源去耦,优先靠近 IC 电源引脚放置。
  • 与旁路电容配合:在磁珠的低端(靠负载一侧)并联大容量旁路电容,形成宽带滤波。
  • 注意直流偏置效应:高直流电流或 DC 偏置会降低磁珠的交流阻抗,设计时应评估工作电流对滤波性能的影响。
  • PCB 布线尽量短且粗,减少寄生电感;焊盘和过孔布局应遵循厂商封装与回流规范。

五、焊接与存储注意事项

  • 采用标准回流焊工艺;推荐按照村田提供的焊接温度曲线与焊盘设计执行以保证可靠性。
  • 避免过度机械应力与弯曲,应采用适当的取放与贴片工艺以防裂纹。
  • 存放环境应干燥、避免高温高湿,若使用防潮封装,开封后按 MSL 要求及时回流。

六、选型与替代建议

  • 若工作电流超过 750 mA,应选用额定电流更高的同系列产品或更大封装以避免 DC 降阻。
  • 若需更高阻抗或覆盖更低频段,参考阻抗频率曲线并选择阻抗值或多级滤波组合。
  • 在替代时核对阻抗频率点、DCR、额定电流与封装尺寸,优先使用同厂相近系列以保证一致性。

如需进一步的阻抗频率曲线、封装尺寸图或推荐焊盘布局,请参照 muRata 官方数据手册或提供具体应用电流/频段,我可协助选择并给出更精确的布板建议。

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