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muRata GRM0335C1H1R6BA01D
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- mu Rata GRM0335C1H1R6BA01D
- Type
- MURATA
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H1R6BA01D
- Electronic Component
- 1
- Electronic Component
- 1.6pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0263493782
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1H1R6BA01D 产品概述
一、产品简介
GRM0335C1H1R6BA01D 为村田（muRata）出品的贴片多层陶瓷电容（MLCC），额定电压 50V，额定容量 1.6 pF，温度系数为 C0G（亦称 NP0）。封装为极小型 0201（英制，适用于高密度贴片组装），适合对容量稳定性和高频特性有严格要求的电路。
二、主要电气特性
- 容值：1.6 pF
- 额定电压：50 V DC
- 温度系数：C0G（Class 1，温漂极小，适合精密应用）
- 介质类型：多层陶瓷（MLCC），低介质损耗，频率特性优良
- 高频特性：低等效串联电感（ESL）和低损耗，适合高频应用
三、性能特点
- 容量稳定性高：C0G 材料随温度、时间及电压偏置引起的容量变化非常小，适合精密滤波、匹配和定时电路。
- 低损耗、高 Q 值：在高频段表现优异，能降低信号衰减与相位误差。
- 小型化封装：0201 大幅节省板面空间，便于高密度设计和微型器件配置。
- 回流焊兼容：适用于常见的 SMT 回流工艺（具体焊接参数请参照厂商资料）。
- 稳定可靠：MLCC 固有的固态结构使其在振动与冲击下可靠性较高。
四、典型应用
- 射频前端：谐振、匹配、带通/陷波网络
- 精密模拟电路：振荡器、参考时钟、滤波与相位稳定网络
- 高频旁路与去耦：用于高频段信号完整性优化与阻抗匹配
- 测量与传感：高精度采样电路、放大器耦合与补偿网络
五、选型与装配建议
- 若对温漂、线性与频率特性有严格要求，优先选择 C0G（Class 1）材料。
- 0201 封装尺寸对贴装精度与锡膏印刷要求高，建议在 PCB 布局时预留合适过孔与回流工艺控制，参照厂商推荐的焊盘尺寸与回流曲线。
- 虽然 C0G 的直流偏压效应极小，但在极端电压或特殊应用下仍建议进行电容偏置特性验证。
- 在最终设计中，应参考 muRata 官方数据手册以获取完整的机械尺寸、可靠性数据和回流焊工艺规范。
如需该料号的详细电气表格、尺寸图或回流曲线，我可以帮您查找或整理出厂数据表中的关键信息。
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