WMSIC Electronic Components

muRata GRM0335C1H470GA01D

ModelGRM0335C1H470GA01D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
mu Rata GRM0335C1H470GA01D
Type
MURATA
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM0335C1H470GA01D
Electronic Component
1
Electronic Component
47pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±2%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0257274319
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM0335C1H470GA01D 产品概述

一、简介

GRM0335C1H470GA01D 为村田(muRata)生产的贴片多层陶瓷电容(MLCC),标称电容值 47 pF,容差 ±2%,额定电压 50 V,温度特性为 C0G(又称 NP0)。该器件属于 0201 极小封装,适用于对温度稳定性与精度要求较高的高频与精密电路。

二、主要特性

  • 高稳定性:C0G/NP0 陶瓷材料随温度变化电容几乎不变,适合需要恒定电容值的应用。
  • 精确容值:±2% 精度满足滤波、定时与谐振电路对容值公差的严格要求。
  • 额定电压 50 V:适用于一般模拟、射频及信号链路的工作电压范围。
  • 极小体积:0201 封装有利于高密度 PCB 布局与微型化设计。
  • 低损耗、低 ESR:适合高频应用,表现出较高的 Q 值与低串联阻抗。

三、典型应用场景

  • 射频(front-end)滤波与匹配网络、谐振电路;
  • 高精度时钟/振荡器的定时元件;
  • 精密模拟电路中的耦合与去耦;
  • 移动设备、可穿戴与射频模块的高密度电路板;
  • 任何要求温度稳定与低介质吸湿性的场合。

四、封装与机械信息

0201(近似 0.6 mm × 0.3 mm)超细封装,适合微型化布局。由于体积极小,对贴装、回流及机械应力较为敏感,需在 PCB 设计与加工工艺上予以注意。标准出货形式为卷带(tape-and-reel),便于自动化贴装。

五、焊接与可靠性建议

  • 遵循元件制造商推荐的回流温度曲线,避免超温或长时间加热;
  • 设计合理的焊盘尺寸与焊膏量,避免过大应力集中;
  • 在关键应用中,注意热循环与机械振动试验的验证;
  • 小尺寸电容在处理与贴装过程中应使用适配的取放工具并控制静电与外力。

六、选型提示

选择 GRM0335C1H470GA01D 时,若系统对温度稳定性、频率特性或体积有严格要求,本型号为优先项。若需更高电压、不同精度或更大电容量,应在同系列或其他系列中对比参数。确认 PCB 制造与组装能力能满足 0201 的工艺要求,以确保良率与可靠性。

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