WMSIC Electronic Components

muRata GRM1555C1H160JA01D

ModelGRM1555C1H160JA01D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM1555C1H160JA01D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM1555C1H160JA01D
Electronic Component
1
Electronic Component
16pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0226508423
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM1555C1H160JA01D 产品概述

一、产品简介

GRM1555C1H160JA01D 是村田(muRata)出品的一款贴片多层陶瓷电容(MLCC),规格为0402(公制1005),额定电压50V,容量16pF,容差±5%(J),介质类型为C0G(又称 NP0)。C0G 属于一类温度补偿型陶瓷,具有优良的电气稳定性和低损耗特性,适用于需要高精度和频率稳定性的电路。

二、主要规格

  • 容值:16 pF
  • 容差:±5%(J)
  • 额定电压:50 V DC
  • 介质:C0G / NP0(Class I)
  • 封装:0402(英制 0.04" × 0.02" / 公制 1.0 × 0.5 mm)
  • 使用温度范围:典型 -55°C 至 +125°C(详见厂商数据表)
  • 特性:低温度系数、低介质损耗、低自谐、低ESR

三、主要特点与电气性能

  • 温度稳定性高:C0G 在典型工作温区内电容变化极小(ppm 级),适合高精度滤波、谐振与定时电路。
  • 低损耗和高 Q 值:用于高频或射频电路时,能保持较低损耗,确保信号完整性。
  • 低偏置效应:相较于X7R等介质,C0G 在直流偏压下电容衰减可忽略,适合精密测量与频率敏感电路。
  • 小封装:0402 封装便于实现高密度布局,但对贴装工艺要求较高。

四、典型应用场景

  • 高频滤波与阻容耦合(RF 前端、收发模块)
  • 谐振回路与振荡器中的定容元件
  • 精密时钟、ADC/DAC 参考网络和传感器前端
  • 高频去耦与阻抗匹配(以小电容补偿为主)
  • 航空航天、通信设备、精密仪器等需稳定电容的场合

五、PCB 设计与焊接注意事项

  • 贴片尺寸虽小,有利于高密度布线,但要使用适配的取放设备与回流焊曲线,避免手工焊接引起焊点应力。
  • 布局时避免在电容两端产生机械应力源(如过度弯曲或重压),封装易因板弯或强力夹紧而破裂。
  • 推荐遵循村田的焊盘与回流焊曲线建议,使用合适的焊膏量与回流温度峰值,避免过热或温度循环过快。
  • 对于关键高频应用,建议在布局时考虑寄生电感、电阻和旁路路径,尽量缩短信号回路。

六、可靠性与测试建议

  • 在设计验证阶段应进行温度循环、振动、跌落与焊接耐受性测试,以确认在目标应用环境中的长期可靠性。
  • 对关键参数(容量、ESR、Q 值、绝缘电阻)进行样品抽测,确认成品与规格书一致。
  • 在高应力应用(机械振动、热循环频繁)中,可考虑芯片加固或选用更大封装以降低破裂风险。

七、替代与采购建议

  • 市场上多家厂商(如 TDK、AVX、京瓷等)均提供相同规格的 0402 C0G 16pF ±5% 50V MLCC,可按数据表比对等效参数后替代。
  • 采购时注意核对完整料号、包装方式(卷带规格)与焊接表面处理,必要时向厂商索取样品和可靠性报告。
  • 对于批量生产建议向授权分销商或原厂直接采购,以保证批次一致性与追溯性。

如需,我可以根据电路应用(如振荡器、滤波或射频匹配)提供具体的布局建议与等效电路影响分析。

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