WMSIC Electronic Components

muRata LQP03HQ2N0B02D

ModelLQP03HQ2N0B02D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata LQP03HQ2N0B02D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LQP03HQ2N0B02D
Electronic Component
1
Package
0201
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
0.008g
Inductor
2nH
Electronic Component
1
Factor
20@500MHz
Electronic Component
BM0058421580
Current
600mA
Frequency
9GHz
Resistor(DCR)
120mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LQP03HQ2N0B02D 产品概述

一、基本参数

LQP03HQ2N0B02D 为村田(muRata)贴片厚膜电感,封装规格为 0201(超小型贴片),关键电气参数如下:感值 2 nH,额定直流电流 600 mA,直流电阻(DCR)约 120 mΩ,品质因数 Q = 20(测量频率 500 MHz),自谐振频率(SRF)约 9 GHz。此器件以小封装、高频性能为主要特征,适用于对体积和频率响应有严格要求的电路。

二、主要特性

  • 超小体积:0201 封装适合高密度 PCB 布局与移动终端微型化设计。
  • 高频性能良好:SRF ~9 GHz,Q 在 500 MHz 时为 20,表明在数百 MHz 至数 GHz 范围内具有稳定的无源特性,适合射频匹配与滤波应用。
  • 中等直流损耗:DCR 约 120 mΩ,在小封装下为合理值,需在功率与热升高约束下使用。
  • 稳定性:厚膜工艺提供在高频下较好的线性与温度稳定性,适合射频前端与高速信号链路。

三、典型应用场景

  • 射频匹配网络(手机、无线模块的输入/输出匹配)
  • 高频滤波器、阻抗调节与微带线匹配单元
  • 去耦与旁路电路中的高频阻抗元件
  • 滤波/偏置网络(bias-tee 中的电感部件)
  • 高频信号链路中的共模/差模调谐(视具体电路拓扑而定)

四、设计与布局建议

  • 最小化寄生:尽量缩短器件与相连焊盘之间的过孔与走线,避免不必要的走线长度以降低寄生电感和寄生电容对特性影响。
  • 布局靠近关键节点:将电感放置在匹配点或滤波节点的最短路径上,减少系列走线。
  • 焊盘与回流:采用与 0201 封装相匹配的焊盘设计,并遵循无铅回流工艺的温度曲线与时间规范以保证焊接可靠性。
  • 热管理与电流裕量:虽然额定电流为 600 mA,但在持续大电流或高温环境中应考虑适当裕量,避免因发热导致参数漂移或可靠性下降。

五、选型与注意事项

  • 频率匹配:若目标工作频率接近或超过 SRF,应重新评估电感行为(将出现容性行为)。
  • DCR 与能耗:120 mΩ 的 DCR 在高电流或功率敏感应用中会带来一定损耗与压降,必要时考虑并联或选用更低 DCR 的方案。
  • 机械处理:0201 属超小型器件,贴装时需使用精密点胶/贴片与适配吸嘴,存储与回流过程须注意防潮与抗振。
  • 测试验证:在最终电路中进行实测(S 参数、插入损耗、温升测试)以确认实际工作点下的性能。

六、包装与可靠性

此类村田贴片电感通常提供带卷盘包装,兼容自动贴片生产线。遵循供应商的保管(防潮)与回流建议,可以保证长期可靠性。对于关键产品建议参考厂方详细资料与可靠性试验报告以满足行业认证需求。

总结:LQP03HQ2N0B02D 以其 0201 的超小封装与 2 nH 的低感量、高 SRF 特性,适用于对空间与高频响应有严格要求的射频与高速电路。选型时需综合考虑 DCR、额定电流与实际电路工作频率以获得最佳性能。

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