WMSIC Electronic Components

muRata GRM155R60J226ME11D

ModelGRM155R60J226ME11D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM155R60J226ME11D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM155R60J226ME11D
Electronic Component
1
Electronic Component
22uF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM69417538
Electronic Component
X5R
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM155R60J226ME11D 贴片电容(MLCC)

一、产品基本信息

  • 产品名称:贴片电容(Multi-layer Ceramic Capacitor, MLCC)
  • 型号:GRM155R60J226ME11D
  • 品牌:村田(muRata)
  • 封装类型:0402(尺寸:1.0mm x 0.5mm)
  • 额定电压:6.3V
  • 容量:22μF
  • 容差:±20%
  • 介质类型:X5R

二、产品特点

GRM155R60J226ME11D 是一种小型、表面贴装式的多层陶瓷电容器(MLCC),以其在高频应用中的良好性能和稳定性而受到广泛欢迎。这一型号具有多种显著的特点,使其适用于各种电子产品的电源管理和信号处理应用:

  1. 小型化设计:0402(1.0mm x 0.5mm)的封装尺寸使得该电容器在电路板上占用极少的空间,适合现代电子产品日益追求的小型化设计。

  2. 高容量和适度的额定电压:22μF的容量在小型电容器中提供了相对较大的存储能力,适合对电源去耦和滤波需求较高的应用。6.3V的额定电压为其提供了良好的电气安全系数。

  3. 温度特性优越:作为X5R陶瓷电容,GRM155R60J226ME11D电容能够在-55℃至+85℃的温度范围内保持良好性能,适应不同环境条件下的使用。

  4. 稳定的电压特性:其低电压偏移特性使得在高频和动态电压变化的条件下,电容值基本保持不变,从而确保了在多种电气条件下的性能稳定性。

  5. 良好的老化性能:该电容器的工作寿命长,老化效应低,使用寿命能够有效保障,从而增强了整个设备的可靠性。

三、应用场景

GRM155R60J226ME11D电容器因其优异的性能特征,广泛应用于多个领域,包括:

  1. 消费电子:如智能手机、平板电脑、笔记本电脑等,常用于电源去耦、射频(RF)滤波以及信号电路的稳定等。

  2. 工业设备:在自动控制系统、传感器信号处理器及工业电脑中,起到隔离和滤波的关键作用。

  3. 汽车电子:随着汽车电子化高度发展,该电容器也应用于汽车控制单元(ECU),电动助力转向等系统中,支持高效稳定的电源和信号处理。

  4. 物联网设备:在IoT设备中广泛使用,支持无线传输的稳定性和电源管理,确保设备6030正常运行。

  5. 医疗设备:在对稳定性和安全性要求较高的医疗器械中,作为去耦和滤波元件,确保设备精确运行。

四、总结

GRM155R60J226ME11D 村田贴片电容(MLCC)以其紧凑的0402封装、高达22μF的容量和良好的电压稳定性能,成为了现代电子设备中必不可少的重要元器件。尤其在高频、高温及多变的环境中,其卓越的温度特性和可靠性,确保了电路的正常运行与稳定性。无论是在消费电子、工业自动化、汽车电子还是医疗仪器领域,它都展现出广泛的适用性和优良的性能,是电子设计工程师在选型时的理想选择。选择GRM155R60J226ME11D,意味着为您的产品注入了高质量和高可靠性的保障。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.