WMSIC Electronic Components

muRata GCM1555C1H681JA16D

ModelGCM1555C1H681JA16D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GCM1555C1H681JA16D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GCM1555C1H681JA16D
Electronic Component
1
Electronic Component
680pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0257268129
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GCM1555C1H681JA16D 产品概述

产品简介

GCM1555C1H681JA16D 是一款由村田(muRata)生产的高品质贴片电容器(MLCC),其电容量为680pF,并具有额定电压50V的优良性能。这款电容器采用表面贴装技术(SMD),符合0402封装标准,尺寸为1.00mm x 0.50mm(长 x 宽),在电子设备中占用极小的空间,适合各种紧凑型设计。

基本参数与技术特性

  • 电容量与容差:该电容器的电容量为680皮法(pF),容差为±5%,能够满足各种应用场景对电容值的精确要求。在关键应用中,确保电容器能源效率和稳定性至关重要,GCM1555C1H681JA16D能够在这种条件下保持可靠性。

  • 额定电压:电容器的额定电压为50V,使其能够在较高电压环境下稳定工作,对于需要高电压的汽车电子和其他工业应用尤为适合。

  • 温度系数:采用C0G(NP0)温度系数,这意味着该电容器在温度变化范围内具有极低的电容量变化,工作温度范围为-55°C至125°C。这种温度鲁棒性对于汽车电子和要求苛刻工作环境的设备至关重要。

  • AEC-Q200 认证:该产品符合AEC-Q200标准,标志着其经过严格的汽车级可靠性测试,能够在恶劣条件下稳定工作,非常适合用于汽车电子系统。

  • 安装类型与封装:作为表面贴装MLCC,GCM1555C1H681JA16D能够轻松地焊接在电路板上,安装方便,适合自动化生产。0402封装的电容器也极大地降低了电子元件在电路板上的空间占用,为小型化设计提供了解决方案。

  • 尺寸与厚度:该电容器的厚度最大为0.55mm,能够确保设计的灵活性,方便与其他元器件配合使用而不增加整体设备的体积。

应用领域

GCM1555C1H681JA16D广泛应用于多个领域,尤其在汽车电子和工业设备中尤为重要。具体应用包括,但不限于:

  • 汽车电子:现代汽车中的各类信号处理、能量存储与滤波,均需要高性能电容器。该款电容器适用于车载信息系统、ADAS(高级驾驶辅助系统)、动力总成控制模块等。

  • 通信设备:在无线通信和数据传输设备中,稳定的电容器对于信号完整性至关重要。该电容器可用于高频信号的滤波与耦合。

  • 消费电子:在便携式设备、计算机以及其他消费电子产品中,由于其小巧的封装和优越的性能,GCM1555C1H681JA16D成为理想选择。

  • 工业控制:在工业自动化和控制系统中,稳定可靠的电容器能够提升系统的整体性能与耐久性。

总结

GCM1555C1H681JA16D是一款兼具高性能与高可靠性的MLCC产品,尤其适合应用于汽车级和工业需求的环境。其680pF的电容量、±5%的容差及50V的额定电压,加上优异的温度特性和AEC-Q200认证,卓越的性能使其成为电子设计的优选组件。不论是在高速电路设计,还是在极端环境中的应用,该电容器均能提供稳定的表现与优质的电气特性,满足现代电子产品对高性能元件的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.