WMSIC Electronic Components

muRata LQG15HS3N6S02D

ModelLQG15HS3N6S02D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata LQG15HS3N6S02D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LQG15HS3N6S02D
Electronic Component
1
Package
0402
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
0.015g
Inductor
3.6nH
Electronic Component
1
Factor
8@100MHz
Electronic Component
BM0257656048
Current
750mA
Frequency
6GHz
Resistor(DCR)
180mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:LQG15HS3N6S02D 贴片电感

一、基本信息

LQG15HS3N6S02D是由村田(muRata)公司生产的一款高性能贴片电感,属于0402封装尺寸(即1005公制)。此款电感的主要特性包括电感值为3.6nH,额定电流750mA,具有优良的频率响应和热稳定性,广泛应用于高频电路及射频模块。

二、产品特点

  1. 结构与材料:

    • LQG15HS3N6S02D采用表面贴装型设计,便于在现代电子设备中进行自动化焊接和组装。其磁芯为空气材料,这意味着该电感具有较低的损耗和良好的温频特性。此外,产品设计为无屏蔽结构,适合用于非敏感电路或在EMI影响较小的环境中使用。
  2. 电气参数:

    • 电感值: 3.6nH,支持高频应用。
    • DC电阻 (DCR): 最大180毫欧,这在设计电源滤波器时有助于降低导通损耗。
    • Q值: 在100MHz频率下,Q值为8,这表明在该频段内电感材料的损耗较低,支持较好的频率特性。
    • 自谐振频率: 该电感的自谐振频率达到了6GHz,确保其在高频工作时的稳定性,避免高频信号的失真。
  3. 工作环境:

    • 它的工作温度范围为-55°C到125°C,适合在极端温度条件下工作,并且具有较强的环境适应能力。适用于汽车电子、通信设备、以及消费电子等多种应用场景。
  4. 尺寸与封装:

    • 尺寸为0.039"(长)x 0.020"(宽),最大安装高度为0.022"(0.55mm),小型化使其能够非常方便地用于空间有限的电子设备中。

三、应用领域

LQG15HS3N6S02D广泛应用于多个领域,包括但不限于:

  1. 射频电路:由于其低电感值和高自谐振频率,适合用于射频前端电路,比如手机和无线通信设备。

  2. 滤波器设计:在高频的电源旁路和去耦应用中,LQG15HS3N6S02D能够有效滤除不必要的高频噪声,提升电路的稳定性和可靠性。

  3. 便携式电子设备:由于其小型化和轻量化特性,非常适合于便携式设备,如智能手机、平板电脑等产品中。

  4. 汽车电子:在现代汽车的电控单元中,对于各种通讯协议的支持,高频信号的稳定性至关重要,这款贴片电感能够满足这些需求。

四、总结

LQG15HS3N6S02D是村田公司推出的一款高性能贴片电感,凭借其小巧的体积、出色的频率性能和广泛的适用温度范围,成为高频电路设计中的理想选择。无论是在通讯、消费电子,还是汽车电子的应用中,LQG15HS3N6S02D都能发挥出色的性能,帮助设计工程师实现更高性能和更小体积的产品。随着电子技术的发展,这款电感的需求预计将会持续增长,成为新一代电子元件的重要组成部分。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.