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muRata LQG18HN27NJ00D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata LQG18HN27NJ00D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- LQG18HN27NJ00D
- Electronic Component
- 1
- Package
- 0603
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.034g
- Inductor
- 27nH
- Electronic Component
- 1
- Factor
- 12@100MHz
- Electronic Component
- BM0257699768
- Current
- 500mA
- Frequency
- 2GHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LQG18HN27NJ00D 产品概述
一、产品简介
LQG18HN27NJ00D 为 muRata（村田）出品的贴片叠层电感，封装规格为 0603（1608 公制）。该型号以小尺寸、高可靠性与良好频率特性为特点，适合在空间受限的高频和射频电路中作为谐振、滤波或阻抗匹配元件使用。
二、主要参数
- 电感值：27 nH
- 精度：±5%
- 额定电流：500 mA（直流饱和前推荐留有裕量）
- 直流电阻（DCR）：540 mΩ
- 品质因数（Q）：12 @ 100 MHz
- 自谐振频率（SRF）：约 2 GHz
- 类型：叠层电感（多层陶瓷结构）
- 封装：0603（1608，贴片）
三、特性与优势
- 小体积：0603 封装便于在高密度 PCB 上布局，有利于空间受限的移动设备或通讯模块。
- 频率特性平衡：Q 值在 100 MHz 时约为 12，自谐振频率达 2 GHz，适用于 VHF/UHF 频段的应用与中频滤波场景。
- 稳定性：叠层结构带来良好的温度与机械稳定性，适合常规回流焊工艺封装应用。
- 适用面广：可用于滤波、阻抗匹配、振荡回路以及作为射频回路中的串联或并联元件。
四、典型应用场景
- 射频前端：匹配网络、陷波/带通滤波器组件。
- 高频滤波与去耦：用于中高频段的共模/差模滤波（视电路拓扑而定）。
- 振荡与谐振回路：作为谐振元件配合电容形成功率或频率控制单元。
- 无线模块、手机、IoT 终端、蓝牙/Wi‑Fi 等通讯设备小信号回路。
五、PCB 布局与焊接建议
- 贴片放置时尽量靠近信号源或噪声源，减少引线长度以降低寄生电感/电阻影响。
- 焊盘设计与回流工艺应遵循厂商推荐尺寸与曲线，避免过度热应力或机械应力。
- 对于高电流应用，考虑增大走线宽度并留出散热空间，减少 DCR 产生的功耗与升温。
- 在接近 SRF 工作时，需要在电路仿真中考虑寄生电容和频率响应的偏移。
六、性能说明与使用注意
- 直流电阻较高（540 mΩ），在作为电源滤波时会带来一定压降与发热，需评估功耗与温升。
- 额定电流 500 mA 为推荐持续电流，应留有裕量以避免接近饱和或温升过高导致参数漂移。
- 自谐振频率（2 GHz）表明器件在该频率上将出现电感向电容行为的转换，设计时应避免在 SRF 附近作为理想电感使用。
- 如需精确频率响应或低损耗表现，建议在目标频段做实际测量或电磁仿真验证。
七、采购与替代建议
- 品牌与型号：muRata LQG18HN27NJ00D，适合对可靠性和一致性有要求的项目。
- 若需更低 DCR 或更高电流能力，可考虑同尺寸下不同系列或更大封装的叠层电感以权衡体积与电性能。
- 量产前建议索取并严格参照村田官方数据手册与封装图纸，进行样片验证与可靠性测试。
如需该型号的详细封装尺寸、回流焊建议曲线或完整电气特性曲线，可提供进一步信息以便查询或导出相关数据手册。
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