WMSIC Electronic Components

muRata BLM21BD601SN1D

ModelBLM21BD601SN1D
Package0805
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
mu Rata BLM21BD601SN1D
Type
MURATA
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
BLM21BD601SN1D
Electronic Component
1
Package
0805
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.04g
Electronic Component
1
Channel Count
1
Electronic Component
BM0257273187
Operating Temperature
55℃~+125℃
Current
300mA
@Frequency
600Ω@100MHz
Resistor(DCR)
350mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BLM21BD601SN1D 产品概述

一、产品简介

BLM21BD601SN1D 为村田(muRata)出品的单通道磁珠(ferrite bead),封装为0805(2012公制,约2.0 × 1.25 mm)。该型号在100 MHz 时阻抗为600 Ω(公差 ±25%),直流电阻(DCR)约350 mΩ,额定直流电流为300 mA,工作温度范围为 -55℃ 至 +125℃。此类器件用于电源与信号线的高频噪声抑制与滤波,兼顾体积小、易贴片与良好频率响应。

二、主要特性

  • 高频阻抗:600 Ω @ 100 MHz(±25%)
  • 直流电阻:约 350 mΩ(典型值)
  • 额定电流:300 mA(应避免长期接近极限以防热升与性能退化)
  • 单通道、0805 表面贴装,适合自动贴装生产
  • 工作温度:-55℃ ~ +125℃,满足大多数工业与民用环境要求
  • 用途:抑制传导型与辐射型 EMI,改善地/电源线噪声谱

三、典型应用场景

  • 手机、平板、可穿戴设备等便携式终端的电源输入/输出滤波
  • 模块化电路(Wi‑Fi、蓝牙、RF)与基带电路的供电去耦
  • 工业控制与汽车电子(需确认具体质量等级与认证)中的干扰抑制
  • USB、HDMI 等高速信号链路的单线共模/差模噪声治理(与电容搭配构成 π 型或 T 型滤波网络)

四、设计与布板建议

  • 串联安装:将磁珠串联在线路中,尽量靠近噪声源(如IC引脚)放置,靠近负载侧放置旁路电容,可形成有效低通或带阻结构。
  • 与旁路电容配合:常与贴片电容(如0.01–1 μF)组合,形成对高频噪声的衰减。
  • PCB 布局:保持最短走线,从噪声源到磁珠、再到旁路电容的路径尽量短且宽,避免环路面积增大。
  • 热管理与电流裕量:实际应用中建议留一定裕度使用额定电流(如 ≤80% 额定值),以减少温升与磁珠特性漂移。
  • 仔细评估阻抗随频率变化:600 Ω@100 MHz 为参考点,低频与更高频区阻抗曲线需参考厂商详尽数据手册以确定滤波效果。

五、可靠性与注意事项

  • 安装工艺:遵循村田推荐的回流焊曲线与湿热、温度循环试验标准,避免超温或长时间高温暴露。
  • 公差影响:阻抗公差 ±25% 意味着批次间高频抑制能力有波动,关键应用应做样机验证与筛选。
  • 机械应力:0805 封装易受焊接与剪切应力影响,贴装与焊接时避免强力挤压。
  • 环保与法规:该系列一般满足无铅/ROHS 要求,具体合规证明请参照厂商出具的合规文件。

六、采购与资料

欲获取完整电气参数、阻抗频率响应曲线、回流焊温度曲线与可靠性试验数据,请参考 muRata 官方数据手册或联系授权分销商。选型时建议索取样品并在目标系统中做电磁兼容(EMC)验证以确保达到预期抑制效果。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.