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muRata LQP03TN5N1H02D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata LQP03TN5N1H02D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- LQP03TN5N1H02D
- Electronic Component
- 1
- Package
- 0201
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±3%
- Electronic Component
- 0.008g
- Inductor
- 5.1nH
- Electronic Component
- 1
- Factor
- 14@500MHz
- Electronic Component
- BM0053637465
- Current
- 350mA
- Frequency
- 4.2GHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LQP03TN5N1H02D 产品概述
产品简介
LQP03TN5N1H02D 是由日本村田（muRata）公司生产的一款高性能表面贴装电感器，属于厚膜电感系列。该产品的主要特点包括小型尺寸、低直流电阻、适用于高频应用等，广泛应用于电子设备中的滤波、能量储存和信号处理等场景。
基础参数
- 电感值: 5.1nH，适合高频信号处理。
- 容差: ±3%，确保电感值在一定范围内的精确性。
- 额定电流: 350mA，适用于中等电流的应用场合。
- DC 电阻 (DCR): 最大 400mΩ，有助于降低能量损耗。
- Q 值: 14 @ 500MHz，表明该电感在高频条件下的优越性能。
- 自谐振频率: 4.2GHz，使其在高频应用中表现出良好的稳定性。
- 工作温度范围: -55°C ~ 125°C，适合多种工作环境和苛刻条件的应用。
尺寸与封装
- 封装类型: 表面贴装型，0501（0603 公制）形式因其小巧体积而特别适合现代紧凑型电子产品。
- 尺寸: 0.024" 长 x 0.012" 宽（0.60mm x 0.30mm），高度最大为 0.013"（0.33mm）。其微小的体积使得LQP03TN5N1H02D能够在空间有限的电路板上进行布置，确保电路设计的紧凑性与集成度。
材料与构造
该电感器采用无磁性核心材料，其设计强调高性能和高效率。无磁性特性有助于减少电感器在高频信号处理过程中产生的干扰，提高信号质量。此外，厚膜技术的使用也为该产品提供了更好的机械强度和化学稳定性。
应用场景
LQP03TN5N1H02D电感器广泛应用于各类高频电路、通信设备及RF设备中，特别是在以下领域：
- 射频（RF）系统: 由于其高自谐振频率和优秀的Q值，非常适合用于振荡器、混频器和放大器等RF电路。
- 功率管理电路: 在DC-DC转换器和电源管理系统中，可以用作滤波器和能量储存元件。
- 嵌入式系统: 在小型计算设备、消费电子产品以及移动设备中，由于其微型封装，能够有效减小整体系统的尺寸。
性能优势
- 高频性能: 通过优化的设计和材料，确保在500MHz及以上频率下依然保持良好的电感特性。
- 低电阻损耗: 较低的DC电阻设计可以显著减少能量损耗，提高系统效率，特别在高功率应用场合，能有效降低发热。
- 广泛的工作温度范围: -55°C至125°C的工作温度范围，使得该电感器适合于各种工作环境，从消费电子到工业设备均能稳定运行。
结论
LQP03TN5N1H02D 作为muRata的一款高品质表面贴装电感器，凭借其小巧的尺寸、卓越的高频性能以及广泛的应用适用性，成为现代电子产品中必不可少的组件之一。无论是在高频信号处理、功率管理还是嵌入式系统中，其可靠性和高性能都使其成为轻量化和高集成度设计中的理想选择。
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