WMSIC Electronic Components

muRata GRM0335C1E101JA01D

muRata GRM0335C1E101JA01D
1 / 2

Product image

ModelGRM0335C1E101JA01D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM0335C1E101JA01D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM0335C1E101JA01D
Electronic Component
1
Electronic Component
100pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0259364821
Electronic Component
C0G
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM0335C1E101JA01D 产品概述

概要

GRM0335C1E101JA01D 是由村田制造（muRata）生产的一款高性能、贴片式多层陶瓷电容（MLCC），适用于各种电子设备中的通用应用。以下是对此产品的详细介绍。

基础参数

  • 电容值: 100 pF
  • 容差: ±5%
  • 电压 - 额定: 25 V
  • 温度系数: C0G，NP0
    • C0G 和 NP0 是指该电容的温度系数，表示其在不同温度下电容值的变化非常小，适用于需要高稳定性的应用。
  • 工作温度范围: -55°C ~ 125°C
    • 这个广泛的工作温度范围使得该电容能够在各种环境条件下稳定运行。

应用场景

GRM0335C1E101JA01D 适用于各种通用电子应用，包括但不限于：

  • 滤波电路: 作为高频滤波器或低通滤波器的一部分，帮助去除噪音和干扰。
  • 耦合电路: 用于信号耦合和分离，确保信号的完整性和清晰度。
  • 能量存储: 在某些情况下，可以作为小容量能量存储元件。
  • 抗震荡电路: 用于稳定电源电压，减少电源噪音对系统的影响。

安装类型和封装

  • 安装类型: 表面贴装（SMT）
    • 适合自动化生产线上的贴片工艺，提高生产效率和可靠性。
  • 封装/外壳: 0201（0603 公制）
    • 小尺寸设计，适合现代电子产品的微型化趋势。

尺寸和厚度

  • 大小 / 尺寸:
    • 长度：0.024 英寸（0.60 mm）
    • 宽度：0.012 英寸（0.30 mm）
  • 厚度（最大值）:
    • 0.013 英寸（0.33 mm）
    • 紧凑的设计使其易于集成到空间有限的 PCB 板中。

品牌和质量保证

GRM0335C1E101JA01D 由村田制造（muRata）生产，村田是全球知名的电子元器件制造商，具有多年丰富的经验和严格的质量控制标准。使用村田产品可以确保高可靠性和稳定性能。

技术特点

高稳定性

  • 由于采用 C0G 和 NP0 温度系数，GRM0335C1E101JA01D 在广泛的温度范围内保持极高的稳定性，这对于许多需要精确控制的应用至关重要。

低失真

  • 该电容具有低失真特性，适合用于高频信号处理和滤波应用中，确保信号的清晰度和完整性。

高耐压性

  • 额定电压为 25 V，能够承受较高的电压冲击，这增加了其在复杂电路中的可靠性。

应用注意事项

PCB 布局

  • 在设计 PCB 布局时，应确保该电容附近没有高频干扰源，以避免信号污染。
  • 合理布局可以帮助减少电磁干扰（EMI）和射频干扰（RFI）。

焊接要求

  • 由于采用表面贴装封装，需要遵循标准 SMT 焊接流程，以确保良好的接触和可靠性。
  • 避免过热或过冷，以防止损坏元件。

总结

GRM0335C1E101JA01D 是一款高性能、通用型多层陶瓷电容，适用于各种电子设备中的不同应用场景。其小尺寸、低失真、高稳定性和广泛工作温度范围，使其成为现代电子设计中的理想选择。通过选择村田制造的此款产品，可以确保您的电子系统具有高可靠性和稳定性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.