WMSIC Electronic Components

muRata GJM0335C1ER80WB01D

ModelGJM0335C1ER80WB01D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
mu Rata GJM0335C1ER80WB01D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GJM0335C1ER80WB01D
Electronic Component
1
Electronic Component
0.8pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0058386613
Electronic Component
C0G
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GJM0335C1ER80WB01D 产品概述

概述

GJM0335C1ER80WB01D是一款由Murata Electronics制造的高性能多层陶瓷电容器(MLCC),属于GJM系列。该元器件设计用于满足高频和射频应用的严格要求,具有优越的电气性能和可靠性。这款电容器在表面贴装设计中采用了0201封装,适用于现代电子设备的小型化和高密度组装需求。

主要参数

  • 电容值: 0.8pF
  • 额定电压: 25V
  • 容差: ±0.05pF
  • 温度系数: C0G,NP0,与使用环境的温度变化有极好的稳定性。
  • 工作温度范围: -55°C 至 125°C
  • 厚度: 最大值为0.013英寸(0.33mm)
  • 封装/外壳: 0201(0603公制),适合表面贴装。
  • 特性: 具备高Q值和低损耗,适合高频信号处理。

应用领域

GJM0335C1ER80WB01D主要应用于以下领域:

  1. 射频及微波应用: 由于其极低的电容值和优良的高频性能,该电容器能够有效过滤和调节高频信号,主要用于RF滤波器、振荡器和信号处理电路。

  2. 通信设备: 适合用于手机、无线电、卫星通信等设备,确保信号稳定性和传输效率。

  3. 消费电子产品: 由于其小型化设计,该电容器被广泛应用于平板电脑、高清电视和各类可穿戴设备中。

  4. 汽车电子: 在高温和严苛工作的环境下,该电容器可以在汽车电子系统中提供高可靠性,如导航系统、车载娱乐系统等。

电气性能与特性

GJM0335C1ER80WB01D以其高Q值而闻名,这使得其在频率响应方面表现出色,能够保持信号的完整性,防止信号衰减。低损耗特性意味着该电容器在工作时能够最小化功率损耗,从而提高整个电路的能效。这种高效的能量传输是实现更高性能电子设备的关键。

另外,该电容器的C0G/NP0温度系数确保在温度范围内,电容值稳定,适合需要高精度和高稳定性的应用。更重要的是,广泛的工作温度范围(-55°C至125°C)使其能够在极端环境下可靠工作。

安装与使用

GJM0335C1ER80WB01D采用0201封装,符合现代电子设备的微型化趋势,方便在PCB(印刷电路板)中进行高密度贴装。由于使用表面贴装技术(SMD),可以实现快速的自动化组装,提高生产效率和降低生产成本。

在设计和使用时,工程师需要注意选择合适的PCB焊接工艺,以保护电容器不受热应力和机械应力的损害,确保其长期性能和可靠性。

结论

GJM0335C1ER80WB01D是一款性能卓越的多层陶瓷电容器,适用于各种高频及射频应用,其小型化设计、高Q值、低损耗及稳定的温度特性,使其成为现代电子设计中不可或缺的重要元件。随着科技的进步和市场对高性能电子设备的需求不断增加,该电容器将继续发挥重要作用,推动行业的发展与创新。

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