WMSIC Electronic Components

muRata GJM1555C1HR10BB01D

ModelGJM1555C1HR10BB01D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
mu Rata GJM1555C1HR10BB01D
Type
MURATA
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GJM1555C1HR10BB01D
Electronic Component
1
Electronic Component
0.1pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0206748596
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GJM1555C1HR10BB01D 产品概述

概述

GJM1555C1HR10BB01D 是一款由村田(muRata)制造的多层陶瓷电容器(MLCC),其设计专注于高频率应用,尤其适用于射频(RF)和微波电路。该电容器凭借其极小的尺寸和优秀的性能,广泛应用于现代电子设备,如通信、消费电子和工业控制系统。

主要规格

  • 电容值:0.1pF
  • 容差:±0.1pF,确保在高精度应用中的可靠性。
  • 额定电压:50V,意味着该电容器能够在不损坏的情况下承受高达50V的直流电压。
  • 温度系数:C0G/NP0,具有稳定的温度特性,适合在大温度范围内使用。
  • 工作温度范围:-55°C 到 125°C,使其能够在极端环境条件下可靠工作。
  • 特性:高 Q 值和低损耗,对于高频电路尤为重要,可以降低信号衰减,提高信号质量。

封装与尺寸

该电容器的封装类型为0402(1005公制),其物理尺寸为:长0.039"(1.00mm)和宽0.020"(0.50mm),最大厚度为0.022"(0.55mm)。这一超小型尺寸使其非常适合应用在空间受限的电路板上,满足现代小型化电子产品的需求。

应用领域

由于其低电容值和高频特性,GJM1555C1HR10BB01D 非常适合用于通信设备、射频(RF)收发器、微波应用、滤波电路和高频信号处理电路等。特别是在无线通信、射频前端模块(RF front-end modules)和高速数据传输(如USB 3.0和HDMI)的应用中,展现出其优异的性能。

性能优势

  1. 高 Q 值:高品质因数使得GJM1555C1HR10BB01D在擦拭电路时,能够有效减小功率损耗,优化信号传输。

  2. 低损耗:通过低损耗特性,该电容器能够在射频应用中保留信号质量,降低由于谐波失真引起的干扰。

  3. 温度稳定性:C0G/NP0 温度系数所带来的优越的温度特性使得该电容器在温度变化时依然保持稳定的电容值,适合要求严格的高频应用。

  4. 抗电压能力:额定电压为50V的设计使得该电容器能够适应多种应用场合,保证长期的工作稳定性。

总结

GJM1555C1HR10BB01D 是一款理想的高频电容器,凭借其优异的电气和环境性能,满足现代电子设备日益严格的性能需求。村田作为知名的电子元器件制造商,产品的可靠性和稳定性备受业界推崇。对于寻求高性能及可靠性的用户来说,选择GJM1555C1HR10BB01D无疑是一个明智的决定。无论是在推荐的高频应用领域,还是在其他对电容器要求较高的场合,该电容器都能提供优秀的解决方案,推动高科技产品的开发与应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.