Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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概述
GJM1555C1HR10BB01D 是一款由村田(muRata)制造的多层陶瓷电容器(MLCC),其设计专注于高频率应用,尤其适用于射频(RF)和微波电路。该电容器凭借其极小的尺寸和优秀的性能,广泛应用于现代电子设备,如通信、消费电子和工业控制系统。
主要规格
封装与尺寸
该电容器的封装类型为0402(1005公制),其物理尺寸为:长0.039"(1.00mm)和宽0.020"(0.50mm),最大厚度为0.022"(0.55mm)。这一超小型尺寸使其非常适合应用在空间受限的电路板上,满足现代小型化电子产品的需求。
应用领域
由于其低电容值和高频特性,GJM1555C1HR10BB01D 非常适合用于通信设备、射频(RF)收发器、微波应用、滤波电路和高频信号处理电路等。特别是在无线通信、射频前端模块(RF front-end modules)和高速数据传输(如USB 3.0和HDMI)的应用中,展现出其优异的性能。
性能优势
高 Q 值:高品质因数使得GJM1555C1HR10BB01D在擦拭电路时,能够有效减小功率损耗,优化信号传输。
低损耗:通过低损耗特性,该电容器能够在射频应用中保留信号质量,降低由于谐波失真引起的干扰。
温度稳定性:C0G/NP0 温度系数所带来的优越的温度特性使得该电容器在温度变化时依然保持稳定的电容值,适合要求严格的高频应用。
抗电压能力:额定电压为50V的设计使得该电容器能够适应多种应用场合,保证长期的工作稳定性。
总结
GJM1555C1HR10BB01D 是一款理想的高频电容器,凭借其优异的电气和环境性能,满足现代电子设备日益严格的性能需求。村田作为知名的电子元器件制造商,产品的可靠性和稳定性备受业界推崇。对于寻求高性能及可靠性的用户来说,选择GJM1555C1HR10BB01D无疑是一个明智的决定。无论是在推荐的高频应用领域,还是在其他对电容器要求较高的场合,该电容器都能提供优秀的解决方案,推动高科技产品的开发与应用。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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