WMSIC Electronic Components

muRata GRM1555C1H180FA01D

ModelGRM1555C1H180FA01D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM1555C1H180FA01D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM1555C1H180FA01D
Electronic Component
1
Electronic Component
18pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±1%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0084326475
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM1555C1H180FA01D

产品名称: GRM1555C1H180FA01D
品牌: muRata(村田)
类型: 多层陶瓷电容器 (MLCC)
封装规格: 0402(1005公制)
基本参数:

  • 电容:18pF
  • 容差:±1%
  • 额定电压:50V
  • 温度系数:C0G(NP0)
  • 工作温度范围:-55°C ~ 125°C
  • 安装类型:表面贴装

产品特性

GRM1555C1H180FA01D是一款高性能的贴片电容器,由业界领先的电子元器件制造商muRata(村田)生产。这款电容器采用了先进的多层陶瓷技术(MLCC),其主要性能参数包括18pF的电容值和±1%的高精度容差,保证了其在高频电路和高稳定性应用中的可靠性。标称的额定电压为50V,能够适应各类电气环境。

该电容器的温度系数为C0G(也称作NP0),这意味着它在广泛的温度范围内(-55°C到125°C)保持极低的温度漂移,适用于高温或低温极端条件下的电子设备。由于其出色的温度稳定性,GRM1555C1H180FA01D非常适合用于精密计量和时钟电路等要求厳格的应用场景。

设计与应用

GRM1555C1H180FA01D的物理尺寸为0402,长0.039英寸(1.00mm),宽0.020英寸(0.50mm),最厚可达0.022英寸(0.55mm)。这一小型化的封装设计使得它能够容易地嵌入紧凑的电路板设计中,非常适用于空间有限的消费电子产品以及便携式设备。

由于其广泛的应用范围,GRM1555C1H180FA01D不仅可以在计算机、通信、医疗、汽车、以及各种消费电子产品中找到身影,还适用于工业控制和高频电路的设计中。其优异的电气特性和热稳定性使其成为混合信号和数据通信系统中的理想选择。

质量与可靠性

作为一个市场领先的品牌,muRata(村田)注重产品的质量和可靠性。GRM1555C1H180FA01D经过严格的测试和验证,确保在使用过程中展现出卓越的性能和稳定性。该电容器符合工业标准,可在多种工作条件下长期可靠运行。设计师和工程师可以信赖这款电容器,以满足其高可靠性和低失效率的需求。

结论

GRM1555C1H180FA01D是一款性能优异、稳定可靠的表面贴装电容器,适合各种高端电子设计。凭借其出色的温度特性、紧凑的表面贴装设计以及高达50V的额定电压,使得这款电容器在现代复杂电路中拥有广泛的应用前景。无论是在工业、汽车还是消费电子领域,GRM1555C1H180FA01D都将为设备的高效、稳定运行做出贡献,为设计人员提供了一个出色的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.