WMSIC Electronic Components

muRata GRM033C81C104KE14D

ModelGRM033C81C104KE14D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM033C81C104KE14D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM033C81C104KE14D
Electronic Component
1
Electronic Component
100nF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0257268631
Electronic Component
X6S
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM033C81C104KE14D 产品概述

一、产品简介

GRM033C81C104KE14D 为 muRata(村田)出品的小尺寸多层陶瓷贴片电容(MLCC),额定容值 100nF(0.1µF),容差 ±10%(K),额定电压 16V,温度特性标注为 X6S,封装为 0201。该器件在极小体积下提供较高的容值,适合空间受限的移动设备与高密度电路板使用。

二、主要技术参数

  • 容值:100nF(0.1µF)
  • 容差:±10%(K)
  • 额定电压:16V DC
  • 温度特性:X6S(适用于宽温区,工作温度范围覆盖低温至高温)
  • 封装:0201(超小型贴片)
  • 系列:GRM033C(村田常见的通用陶瓷电容系列)

三、特性与优势

  • 体积极小,适合高密度 PCB 布局与微型产品设计;
  • MLCC 本征具备低 ESR、低 ESL 特性,适合高频去耦与旁路应用;
  • X6S 温度特性在宽温区内保持相对稳定的电容量表现,适用于工业级温度要求较高的场合;
  • 村田品牌制造工艺成熟、品质控制严格,良品率与一致性高,可靠性可控。

四、典型应用

  • 电源去耦与旁路(尤其是数字芯片、电源管理 IC);
  • 移动终端、耳机、可穿戴设备等对空间要求严格的消费电子产品;
  • 通信设备、路由器与高频模块的滤波与稳定电源回路;
  • 任何需要小型化、低电感去耦的高密度电路设计。

五、设计与装配注意事项

  • DC bias 效应:高介电常数 MLCC 在接近额定电压时电容量会下降,设计时应在电路仿真与去耦计算中考虑此衰减;
  • 贴装应采用推荐的焊盘尺寸与回流焊工艺,避免手焊或过度加热;遵循厂商回流温度曲线以确保焊接可靠性;
  • 机械应力敏感:小尺寸陶瓷电容易受 PCB 弯曲或紧固件应力影响,布线与固定时避免在器件上施加应力;
  • 防潮、防静电:开封后按干燥包装规定在限定时长内使用;操作时采取静电防护措施。

六、可靠性与选型建议

  • 若工作环境温度或电压接近器件极限,建议留充裕裕度或选择更高额定电压/更大封装以减小 DC bias 与温漂影响;
  • 对于关键去耦回路,可并联多种容值与封装(例如 0201 与 0402、或与陶瓷+钽/固态电容混合)以兼顾低频与高频特性;
  • 量产前建议进行实际工况下的温度循环、湿热与焊接热冲击验证。

七、包装与替代件

  • 村田常规提供卷带盘装,适用于自动贴片机;具体包装规格请参考 Datasheet 与采购信息;
  • 同类替代件可在 TDK、三星、KEMET 等厂商中寻找 0201 封装、100nF、16V、相近温度特性的 MLCC,选型时注意温度特性(X6S/X5R/X7R)与 DC bias 差异。

以上为 GRM033C81C104KE14D 的要点汇总,供器件选型、布局与可靠性评估参考。欲获取更详细的电气参数、回流曲线与尺寸图,请参阅 muRata 官方 Datasheet。

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