Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM21B5C1H223JA01L
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM21B5C1H223JA01L
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM21B5C1H223JA01L
- Electronic Component
- 1
- Electronic Component
- 22nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0058406910
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM21B5C1H223JA01L 产品概述
一、产品简介
GRM21B5C1H223JA01L 为村田（muRata）生产的贴片多层陶瓷电容（MLCC），规格为0805（2012公制），额定电压 50V，标称电容 22nF（223），容差 ±5%，介质性能为 C0G（Class 1 / NP0）。该型号以温度稳定性高、损耗低和电容随偏压变化小而著称，适合对精度与稳定性要求严格的电路使用。
二、主要性能特点
- 温度系数：C0G（近零温度系数），典型温度系数在 ±30 ppm/°C 范围，-55°C 至 +125°C 工作温度范围内电容变化极小。
- 电压与稳定性：额定工作电压 50V，C0G 陶瓷对直流偏压敏感度极低，适合低漂移应用。
- 损耗与噪声：低介质损耗（低 DF / tanδ），在高频下表现良好，常用于射频与高精度模拟电路。
- 封装与工艺：0805 封装，适配自动贴装与回流焊工艺，可靠性高，适合大批量生产。
三、典型应用场景
- 高频滤波、阻抗匹配与射频电路中的耦合/旁路电容。
- 振荡器、定时与相位阵列等对频率稳定性要求高的电路。
- 精密模数/数模转换（ADC/DAC）前端的采样电容与旁路电容。
- 电路参考源、仪器仪表与传感器接口中的稳定耦合与隔离。
四、封装与机械尺寸
0805（公制 2012）尺寸约为 2.0 mm × 1.25 mm，厚度随具体系列略有差异，适配常见印制板走线与贴装工艺。产品通常以卷带（Tape & Reel）形式提供，方便 SMT 自动化生产。
五、使用建议与注意事项
- 回流焊：可支持无铅回流工艺，建议按照厂商回流曲线进行焊接以确保可靠性。
- 机械应力：贴片陶瓷件对焊接/板弯曲应力敏感，PCB 设计时应避免过度应力集中（过孔、划线或弯曲位置远离元件）。
- 直流偏压与温度影响：虽 C0G 对偏压和温度稳定，但在极端环境下仍需留有裕量，按额定电压和工作温度范围设计。
- 存储与装配：避免强烈冲击与刮擦，标准包装下可直接进行贴装，无特殊干燥要求，但长时间暴露在潮湿环境后建议按生产线要求处理。
六、型号拆分与采购信息
型号中包含的信息可帮助快速识别：GRM21 表示系列及尺寸，C1H/223/J 等编码指代材质、容值与容差，A01L 常用于包装/盘带信息。采购时请参考村田官方数据手册以确认完整电气特性与可靠性试验结果，并根据所需批次索取放样或认证报告。若有更高容量或不同电压、容差需求，可咨询替代型号与库存情况。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
