WMSIC Electronic Components

muRata LQP03TN18NH02D

ModelLQP03TN18NH02D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata LQP03TN18NH02D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LQP03TN18NH02D
Electronic Component
1
Package
0201
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
±3%
Electronic Component
0.008g
Inductor
18nH
Electronic Component
1
Factor
12@500MHz
Electronic Component
BM0263437645
Current
200mA
Frequency
2.2GHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LQP03TN18NH02D 产品概述

一、产品简介

LQP03TN18NH02D 为 muRata(村田)系列0201超小型厚膜贴片电感,标称电感量为 18 nH,公差 ±3%。该器件以体积极小、适配高频电路设计为特点,适用于对体积、重量有严格要求的移动终端、射频前端及高频滤波网络。

二、主要参数

  • 电感值:18 nH ±3%
  • 额定直流电流:200 mA(连续工作)
  • 直流电阻(DCR):0.8 Ω(800 mΩ)
  • 品质因数(Q):12 @ 500 MHz
  • 自谐振频率(SRF):2.2 GHz
  • 类型:厚膜电感(贴片)
  • 封装:0201(超小型)
  • 品牌:muRata(村田)
  • 型号:LQP03TN18NH02D

三、电气特性与性能要点

该电感在中高频段具有合理的 Q 值(500 MHz 时 Q≈12),适合用于阻抗匹配、带通/带阻网络与谐振回路等高频场合。SRF = 2.2 GHz,说明在该频率以上电感呈现容性行为,选型时应保证工作频率远低于自谐频率以保持感性特征。DCR 较高(0.8 Ω),表明器件损耗相对较大,不适合用于需要极高 Q 或大电流的高性能谐振电路;但在匹配与 EMI 抑制等需要小体积且允许一定串联损耗的场合可接受。

功耗示例:在额定电流 200 mA 条件下,I^2·R ≈ 32 mW,器件热负荷较小,但仍需关注在并联或密集布局下的热与电流共享问题。

四、典型应用场景

  • 射频前端的阻抗匹配网络(手机、蓝牙、NB-IoT 等)
  • 射频滤波器、谐振回路与微带元件补偿
  • 高速数字系统的共模/差模滤波(作为串联小电感)
  • 对体积敏感的可穿戴设备、物联网节点等微型化设计

五、选型与注意事项

  • 确保工作频率低于 SRF,预留裕量以避免寄生电容影响电路响应。
  • 若电路要求低损耗与高 Q,应选择 DCR 更低、Q 更高的型号;LQP03TN18NH02D 更适用于空间受限且允许一定损耗的方案。
  • 关注直流偏置下电感量的下降(磁饱和行为),在有明显直流偏置的设计中需验证实际电感值。
  • 考虑封装 0201 的可贴装性与锡膏印刷要求,搬运与回流工艺需严格控制。

六、贴装与可靠性建议

  • 使用高速贴片机与精细锡膏印刷,避免错位与缺锡。
  • 遵循厂商推荐回流曲线进行焊接,避免超温或过长的热暴露。
  • 采用合理焊盘设计与机械应力缓冲,防止在震动或热循环中发生裂纹。
  • 量产前进行实际电路板上的电感量和 Q 值验证,确认与仿真模型一致。

总结:LQP03TN18NH02D 为一款适合中高频、小体积应用的厚膜贴片电感,适用于射频匹配与滤波等场景。在选型时应综合考虑 SRF、DCR、Q 值及工作电流等参数,以确保在目标频段和功率条件下获得稳定可靠的电气性能。

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