Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM1555C1H330JA01D是一款由村田(muRata)公司制造的表面贴装多层陶瓷电容器(MLCC),其电容量为33皮法(pF),具备±5%的容差和最高额定电压为50伏(V)。此款电容采用温度系数C0G(也称为NP0),能够在极端温度范围内(-55°C至125°C)保持稳定的电性能。这使得它在高精度电路中得到了广泛应用。
此款电容器采用0402封装(1005公制),尺寸为0.039英寸(1.00毫米)长和0.020英寸(0.50毫米)宽,厚度最大为0.022英寸(0.55毫米)。0402封装是电子设备中使用的标准小型封装之一,适合空间有限的设计,能够满足高密度电路板的需求。
GRM1555C1H330JA01D电容器因其出色的性能,广泛应用于多个领域,包括但不限于:
GRM1555C1H330JA01D电容的主要性能特点包括:
该类型电容器为表面贴装(SMD),适合自动化生产线的贴片技术。注意在焊接时,应控制焊接温度以防止过热损坏电容器的内部结构。同时,建议在设计PCB时考虑到电容器的引脚布局,以保证良好的焊接花样和电气性能。
GRM1555C1H330JA01D凭借其小巧的尺寸、高性能的特点以及广泛的适用性,成为现代电子设备中不可或缺的电子元件。村田作为业界领先的制造商,其产品以高品质和高技术性著称,GRM1555C1H330JA01D电容器无疑是满足高精度和高稳定性需求的理想选择。无论是在消费电子、工业控制还是医疗设备等多个领域,它都能为设计师提供卓越的性能与效率,是先进电子设计中的关键组件之一。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products