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muRata GRM0335C1H7R0BA01D
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GRM0335C1H7R0BA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H7R0BA01D
- Electronic Component
- 1
- Electronic Component
- 7pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0265972263
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1H7R0BA01D 产品概述
一、产品概述
GRM0335C1H7R0BA01D 为村田（muRata）生产的多层陶瓷贴片电容（MLCC），标称容值 7 pF，额定电压 50 V，温度特性为 C0G（亦称 NP0）。该型号采用极小型贴片封装（0201），面向高密度装配与高频电路对电容稳定性和低损耗的要求。
二、主要电气性能
- 容值：7 pF（标称）。
- 额定直流电压：50 V。
- 温度系数：C0G / NP0，温度漂移极小（典型 ±30 ppm/°C 量级），随温度变化几乎无容值漂移。
- 损耗与自谐：介质损耗低，Q 值高，自谐频率较高，适合 RF、滤波与频率控制场合。
说明：具体的等效串联电阻（ESR）、等效串联电感（ESL）与自谐频率请参照厂商数据手册。
三、封装与机械特性
0201 超小封装适合高密度 PCB 布局与微型化终端产品。该封装对焊接工艺及 PCB 贴装精度要求较高，抗机械应力能力相对较弱，应注意处理与回流焊温度轮廓的控制。
四、典型应用场景
- 射频前端：匹配网络、耦合与旁路。
- 振荡器与滤波器：因温漂小适用于频率敏感电路。
- 高频旁路与去耦：在 MHz~GHz 频段表现优良。
- 高密度移动、可穿戴与物联网终端。
五、设计与装配建议
- 布局：尽量缩短引线长度，靠近被旁路或匹配的器件放置。
- 焊接：使用合适的回流曲线（遵循无铅标准峰值温度），避免多次高温循环。
- 贴装：使用精确的贴片机及锡膏印刷模板，防止偏位或桥锡。
- 机械防护：在振动或冲击环境建议加固或选用更大尺寸/抗应力设计。
六、可靠性与选型注意事项
C0G（NP0）介质无显著老化效应，电容稳定性好，但 0201 体积极小，耐热与耐机械冲击能力受限。选型时应确认工作电压裕量、工作温度范围以及实际频率特性；若存在高压脉冲或高应力焊接，需评估失效风险并参考村田的可靠性试验数据。
七、结论与资料获取
GRM0335C1H7R0BA01D 以其优秀的温度稳定性、低损耗和极小体积，适合高频和高密度电子产品中的关键应用。购买与设计前，请下载并核对村田官方数据手册，确认封装尺寸、焊接条件及电气测量基准以满足最终系统要求。
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