Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM0335C1E681JA01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM0335C1E681JA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1E681JA01D
- Electronic Component
- 1
- Electronic Component
- 680pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0257359350
- Electronic Component
- C0G
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1E681JA01D 产品概述
一、产品简介
GRM0335C1E681JA01D 是村田（muRata）生产的一款多层陶瓷电容（MLCC），规格为 680 pF、额定电压 25 V、容差 ±5%，温度特性为 C0G（亦称 NP0），封装为 0201（公称尺寸非常小，适合高密度贴装）。该器件属于低介质损耗、温漂极小的精密电容器，适用于对频率、时间常数要求严格的电路。
二、主要性能与参数
- 容值：680 pF ±5%
- 额定电压：25 V DC
- 温度系数：C0G/NP0（典型 ±30 ppm/°C，线性且稳定）
- 封装：0201（超小型 SMD）
- 特性：低介电损耗、高 Q 值、无可测老化效应，介电稳定性优良，电容随温度变化极小。
三、典型应用
- 高频滤波与阻抗匹配（RF 前端、射频滤波器）
- 精密定时与振荡电路（振荡器、相位锁定环）
- 高精度采样与 ADC 前端耦合/旁路（要求低漏电、低温漂时）
- 精密模拟电路（增益网络、反馈回路）
四、封装与组装建议
0201 尺寸体积极小，贴装时需注意：
- 使用适配微小封装的吸嘴和分板工艺，避免机械冲击或偏压导致电容破裂。
- 推荐采用标准无铅回流焊工艺（遵循 IPC/JEDEC 曲线），峰值温度通常不超过 260°C，详见厂商回流建议。
- 对 PCB 设计建议使用合适的焊盘尺寸和丝印，减少应力集中并确保良好焊接可靠性。
五、可靠性与品质特性
- C0G 型陶瓷在温度范围内电容值变化极小、无老化现象，适合长期稳定工作的应用。
- 村田产品通过严格的品质控制，具有高绝缘电阻、低漏电流和优良的寿命特性。
- 0201 为微小封装，易受湿度与机械应力影响，建议按厂商说明进行干燥保存与防潮管理。
六、替代型号与采购建议
- 同类替代可选用 TDK、KEMET、AVX 等厂家的 NP0/C0G 0201 系列产品，选择时核对容值、额定电压、温漂与封装一致性。
- 采购注意产品包装批号、库存状态与出厂测试报告，量产时建议索取样片并在目标板上做热循环与机械应力验证。
总结：GRM0335C1E681JA01D 以其极小尺寸与优良的温度稳定性，适合对体积与性能有双重要求的精密电子设计，但在组装与储存环节需特别注意工艺与防护，以保证长期可靠性。
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