WMSIC Electronic Components

muRata GRM033R61E102KA01D

ModelGRM033R61E102KA01D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM033R61E102KA01D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM033R61E102KA01D
Electronic Component
1
Electronic Component
1nF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0263454237
Electronic Component
X5R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM033R61E102KA01D 村田多层陶瓷电容(MLCC)产品概述

一、产品型号解析与基本参数

GRM033R61E102KA01D是村田(muRata)推出的通用型多层陶瓷电容(MLCC),其型号命名严格遵循村田MLCC的标准规则,各段代码对应精准参数:

  • GRM:村田常规MLCC系列标识(区别于车规级GRM系列);
  • 033:封装代码,对应英制0201封装(尺寸约0.02in×0.01in,公制0.3mm×0.2mm);
  • R:电介质系列标识(钛酸钡基陶瓷);
  • 61:电介质特性补充代码;
  • E:额定电压代码,对应25V直流额定电压;
  • 102:容值代码,10×10²pF=1nF(1000pF);
  • K:精度代码,对应**±10%容值偏差**;
  • A01:温度特性与包装补充代码(匹配X5R温度系数);
  • D:编带包装标识(适用于自动化SMT贴装)。

核心参数汇总:

参数项 具体值 封装类型 0201(英制) 额定容值 1nF(1000pF) 容值精度 ±10% 额定电压(DC) 25V 温度系数 X5R(-55℃~+85℃,ΔC/C±15%) 电介质材料 钛酸钡基陶瓷 包装方式 8mm编带(10000pcs/盘)

二、核心性能特点

该型号电容因参数均衡、工艺成熟,具备以下核心优势:

  1. 小尺寸高集成度:0201封装体积仅约0.6mm³(长×宽×高≈0.6mm×0.3mm×0.3mm),适配智能手机、智能穿戴等高密度PCB设计,满足产品小型化需求;
  2. 稳定温度特性:X5R温度系数覆盖-55℃至+85℃,容值漂移控制在±15%以内,避免极端温度下电路性能波动;
  3. 低ESR与高频适配:多层陶瓷结构带来低等效串联电阻(ESR),在100kHz~1GHz频段内阻抗特性优异,适合射频耦合、电源去耦等高频场景;
  4. 高可靠性一致性:村田陶瓷成型与电极印刷工艺成熟,产品失效率≤0.1%(符合JIS C 5102标准),批量一致性好,减少电路调试难度;
  5. 环保合规:符合RoHS 2.0、REACH指令,不含铅、镉等有害物质,适配全球市场环保要求。

三、典型应用场景

因参数匹配度高,该型号广泛应用于以下领域:

  1. 消费电子:智能手机WiFi/蓝牙模块滤波、智能手表传感器电源去耦、蓝牙耳机信号耦合电路;
  2. 工业控制:PLC输入输出模块电源滤波、小型电机驱动电路EMI抑制;
  3. 物联网设备:智能温湿度传感器信号调理、低功耗无线模块去耦;
  4. 车载非动力系统:车载信息娱乐系统(IVI)触控面板滤波、倒车影像信号耦合(需确认具体车规认证,部分型号为消费级)。

四、可靠性与环境适应性

产品设计充分考虑应用场景的可靠性需求:

  • 温度适应性:工作温度-55℃+85℃,存储温度-55℃+125℃,满足工业级与消费级环境;
  • 机械可靠性:抗振动(IEC 60068-2-6,10~2000Hz/1g)、抗冲击(IEC 60068-2-27,1000m/s²),适合移动设备日常振动;
  • 长期稳定性:额定条件下容值漂移≤0.5%/1000小时,确保电路长期性能稳定;
  • 焊接可靠性:适配回流焊(240℃~260℃峰值,≤10秒)与波峰焊,焊接后无裂纹、虚焊缺陷。

五、选型与使用注意事项

  1. 电压余量:实际工作电压需低于25V,建议留1.2~1.5倍余量(如≤20V),避免过压击穿;
  2. 温度场景:若环境温度超+85℃(如汽车动力系统),需更换X7R(-55℃~+125℃)电容;
  3. 精度适配:±10%适用于通用滤波,若需高精度(如振荡电路),选J类(±5%)或F类(±1%);
  4. 焊接控制:回流焊温度需符合J-STD-020标准,避免过温导致陶瓷开裂;
  5. 静电防护:MLCC为静电敏感元件(人体模式ESD≤1kV),生产需佩戴静电手环、使用静电包装。

该型号是村田通用MLCC的典型代表,平衡了尺寸、性能与成本,是消费电子、工业控制等领域的高性价比选择。

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