WMSIC Electronic Components

muRata GRM0335C1E2R0BA01D

ModelGRM0335C1E2R0BA01D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
mu Rata GRM0335C1E2R0BA01D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM0335C1E2R0BA01D
Electronic Component
1
Electronic Component
2pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0264727684
Electronic Component
C0G
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM0335C1E2R0BA01D 产品概述

1. 产品简介

GRM0335C1E2R0BA01D 是 muRata(村田)公司生产的一款多层陶瓷电容器(MLCC),属于其 GRM 系列产品。该电容器具有超小尺寸、高精度和优异的温度稳定性,广泛应用于各种电子设备中,尤其是在空间受限的高密度电路设计中。

2. 关键参数

  • 电容值: 2pF
  • 容差: ±0.1pF
  • 额定电压: 25V
  • 温度系数: C0G(NP0)
  • 工作温度范围: -55°C ~ 125°C
  • 安装类型: 表面贴装(SMD)
  • 封装/外壳: 0201(0603 公制)
  • 尺寸: 0.024" 长 x 0.012" 宽(0.60mm x 0.30mm)
  • 厚度(最大值): 0.013"(0.33mm)

3. 产品特点

  • 超小尺寸: 采用 0201 封装,尺寸仅为 0.60mm x 0.30mm,非常适合高密度电路板设计。
  • 高精度: 容差为 ±0.1pF,确保了电路设计的精确性和稳定性。
  • 优异的温度稳定性: 采用 C0G(NP0)温度系数,在 -55°C 至 125°C 的温度范围内,电容值变化极小,适用于对温度稳定性要求高的应用。
  • 高可靠性: 村田公司以其高质量和可靠性著称,GRM0335C1E2R0BA01D 经过严格的质量控制和测试,确保在各种应用环境中都能稳定工作。
  • 表面贴装设计: 适用于自动化表面贴装工艺,提高生产效率和一致性。

4. 应用领域

GRM0335C1E2R0BA01D 由于其优异的性能和超小尺寸,广泛应用于以下领域:

  • 通信设备: 如智能手机、平板电脑、无线模块等,用于射频(RF)电路和信号处理电路。
  • 消费电子: 如数码相机、便携式音频设备、游戏机等,用于电源滤波和信号耦合。
  • 工业控制: 如传感器、PLC、工业自动化设备等,用于信号调理和滤波。
  • 医疗设备: 如便携式医疗监测设备、诊断仪器等,用于信号处理和电源管理。
  • 汽车电子: 如车载娱乐系统、导航系统、传感器等,用于信号滤波和电源管理。

5. 技术优势

  • C0G(NP0)温度系数: 提供极低的电容温度系数,确保在宽温度范围内电容值稳定,适用于高精度和高稳定性的应用。
  • 高额定电压: 25V 的额定电压,适用于多种电路设计,提供更高的电压裕量。
  • 低 ESR 和 ESL: 低等效串联电阻(ESR)和等效串联电感(ESL),提供优异的滤波性能和高频响应。
  • 环保材料: 符合 RoHS 和 REACH 等环保法规,确保产品对环境友好。

6. 封装与尺寸

GRM0335C1E2R0BA01D 采用 0201 封装,尺寸为 0.60mm x 0.30mm,厚度最大为 0.33mm。这种超小尺寸使得它非常适合用于高密度电路板设计,尤其是在空间受限的便携式设备中。

7. 品牌与质量保证

muRata(村田)是全球领先的电子元器件制造商,以其高质量和可靠性著称。GRM0335C1E2R0BA01D 经过严格的质量控制和测试,确保在各种应用环境中都能稳定工作。村田公司还提供全面的技术支持和售后服务,帮助客户解决设计和应用中的问题。

8. 总结

GRM0335C1E2R0BA01D 是 muRata 公司推出的一款高性能多层陶瓷电容器,具有超小尺寸、高精度和优异的温度稳定性。它广泛应用于通信设备、消费电子、工业控制、医疗设备和汽车电子等领域,是各种高密度电路设计的理想选择。凭借其卓越的性能和可靠性,GRM0335C1E2R0BA01D 将继续在电子元器件市场中占据重要地位。

通过以上详细的产品概述,可以看出 GRM0335C1E2R0BA01D 在多个方面都表现出色,是一款值得信赖的电子元器件。无论是在设计阶段还是实际应用中,它都能为用户提供稳定可靠的性能支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.