Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM032R60J105ME05D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- mu Rata GRM032R60J105ME05D
- Type
- MURATA
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM032R60J105ME05D
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0264857021
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM032R60J105ME05D 产品概述
一、规格概述
GRM032R60J105ME05D 为 muRata（村田）系列的片式多层陶瓷电容（MLCC），基础参数如下：额定电容 1.0 µF，容差 ±20%，额定电压 6.3 V，介质材料 X5R，封装尺寸 0201（极小型贴片）。此型号主打高密度封装下的去耦与滤波功能，适用于空间受限、移动设备等对尺寸和焊接工艺要求高的场景。
二、主要性能特点
- 体积极小（0201），适合高密度布局与微型化产品。
- X5R 介质在温度范围内（通常至 +85°C）具有相对稳定的电容表现，适合一般工业和消费电子温度等级的应用。
- 额定电压 6.3 V，适用于低压电源旁路、CPU/GPU/PMIC 的局部去耦。
- 良好的高频响应与低等效串联电阻（ESR），在去耦和快速瞬态吸收方面表现优良。
三、电气行为与设计注意事项
- DC-bias 效应：在高介质常数的 MLCC 上，施加直流偏压会导致有效电容下降。尤其是 0201 尺寸的 1 µF / 6.3 V 类型，在接近额定电压工作时电容可能明显降低。设计时应评估实际工作电压下的剩余电容。
- 温度与容差：所列容差为 ±20%，在温度变化下的总容差需同时考虑温度系数（X5R）与初始公差，关键电路请预留裕量。
- 机械应力敏感：0201 封装对焊接应力和基板翘曲敏感，开模与焊盘设计需符合制造商推荐以减少破裂风险。
四、典型应用场景
- 手机、平板、可穿戴设备等移动终端的电源旁路与本地去耦。
- IoT 模组、蓝牙/无线通信卡的滤波与稳定电路。
- 精密小型传感器和低功耗微控制器的局部电容储能与瞬态响应场合。
五、封装与工艺建议
- 贴片工艺：建议采用精密贴装设备与适配 0201 的吸嘴，控制回流焊曲线以避免过热或过快冷却引起的应力。
- 焊盘设计：参考村田推荐的 land pattern，焊膏量不要过多以避免浮焊或桥接，过少又会降低焊接强度。
- 检测与可靠性：对于关键器件推荐进行 X-ray 或目检以确认焊接质量；在高可靠性项目中考虑热循环和振动测试。
六、选型要点与替代建议
- 若电路对有效电容要求严格，建议验证在实际偏压和温度条件下的电容值；必要时选择额定电压更高或更大容差/更稳定介质（如 X7R / 更高V）型号。
- 对于需要更低 ESR 或更大电流承受能力的应用，可考虑尺寸稍大的封装或专用钽电容/固态电容作为替代。
总结：GRM032R60J105ME05D 以 0201 超小封装、1 µF 容值和 X5R 介质在移动与微型化产品中提供良好的去耦与滤波解决方案。设计时应重点关注 DC-bias、温度特性与焊接工艺，以确保在实际工作条件下满足电路性能要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
