WMSIC Electronic Components

muRata GRM0335C1H3R0CA01D

ModelGRM0335C1H3R0CA01D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
mu Rata GRM0335C1H3R0CA01D
Type
MURATA
Unit
Electronic Component
Minimum package
15000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM0335C1H3R0CA01D
Electronic Component
1
Electronic Component
3pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0257279604
Electronic Component
C0G
Voltage
50V
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM0335C1H3R0CA01D 产品概述

一、产品概况

GRM0335C1H3R0CA01D 为村田(muRata)出品的陶瓷多层片式电容(MLCC),封装为 0201(约 0.6 mm × 0.3 mm)。标称电容 3 pF,额定电压 50 V,温度系数为 C0G(又称 NP0),公差以绝对值表示为 ±0.25 pF。小尺寸、高精度与温度稳定性是其主要特点。

二、主要电气特性与性能优势

  • 电容:3 pF;公差:±0.25 pF(绝对误差,适合低容值的精密需求)
  • 额定电压:50 VDC,适用于一般信号与小功率场合
  • 温度系数:C0G/NP0(典型 ±30 ppm/°C),表现出极低的温度漂移与极高的线性度
  • 损耗低、等效串联电阻/电感(ESR/ESL)较小,适合高频应用与高 Q 值电路
  • 对直流偏置敏感性极小,电容随偏置电压变化很少

三、典型应用场景

  • 高频射频匹配网络、滤波器、谐振回路、定时与振荡电路
  • 精密频率元件与相位阵列、低噪声放大器的阻抗匹配
  • 对空间、重量敏感的移动设备与穿戴电子产品的高密度板级布局
  • 测试与测量设备中需要稳定低漂移的小电容元件的场合

四、封装与工艺建议

  • 0201 封装体积小,适合高密度布局,但对贴装精度和焊接工艺要求高
  • 建议严格按照村田数据手册提供的推荐焊盘尺寸与回流焊曲线执行,控制焊膏量以避免虚焊或桥连
  • 0201 件对机械应力敏感,避免 PCB 弯曲与过度剪切力,贴装时优先使用高精度贴片机
  • 选型与测量时注意用高频 LCR 测试仪并做开/短校正,测量环境噪声对 pF 级元件影响明显

五、可靠性与注意事项

  • C0G 材料具有优秀的长期稳定性和温度稳定性,但 0201 机械强度有限,需注意振动与冲击环境的可靠性验证
  • 在高湿、高温循环环境中仍需做加速老化与焊接应力测试以确认寿命
  • 对于要求更高容差或配对电容,应考虑用同一批次器件并做前端筛选匹配

六、选型要点与替代建议

  • 当需在极小体积内获得低漂移、电压稳定的小电容时,本器件为优选
  • 若需更大电压或不同公差,可参考村田相近系列或其它厂商(TDK、AVX、KEMET)具有相同规格的 MLCC,但建议以数据手册一致性为准
  • 设计时优先使用生产厂商的封装与回流规范,确保长期可靠性与一致性

如需该型号的详细数据手册(尺寸图、焊盘推荐、回流曲线、完整电气特性曲线)或替代料号比对,我可进一步提供对应资料与建议。

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