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muRata GCM033R71A222KA03D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- mu Rata GCM033R71A222KA03D
- Type
- MURATA
- Minimum package
- 15000
Technical parameters
- Electronic Component
- MURATA
- Electronic Component
- GCM033R71A222KA03D
- Electronic Component
- 1
- Electronic Component
- 2.2nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0257629964
- Electronic Component
- X7R
- Voltage
- 10V
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GCM033R71A222KA03D 产品概述
一、电气性能概览
GCM033R71A222KA03D 为村田（muRata）0201 封装多层陶瓷电容，名义容值 2.2 nF（0.0022 μF），公差 ±10%，额定直流电压 10 V。采用 X7R 陶瓷介质，典型工作温度范围可覆盖 -55°C 至 +125°C（X7R 在该范围内的温度特性一般在 ±15% 以内），适合对温度稳定性有中等要求的旁路、滤波与耦合场合。
二、物理与封装特性
0201（约 0.6 mm × 0.3 mm）超小尺寸，适用于高密度贴片组装。小体积带来较低 ESL，有利于高频性能；但相对电荷量小、对机械应力敏感，焊接与 PCB 设计需特别注意以避免裂纹或失效。产品描述中标注 Automotive / 125°C，表明面向汽车应用并满足高温可靠性要求（具体合规性请参照厂方数据表）。
三、典型应用场景
- 高频旁路与去耦（尤其空间受限的高速数字模块）
- RC 滤波、耦合与阻抗匹配网络
- 精密模拟前端的滤波网络（需考虑 X7R 的温漂与偏压特性）
- 汽车电子中对体积和温度耐受有严格要求的子电路
四、设计与焊接建议
- 在布局时为器件两端焊盘留足缓冲区，避免 PCB 弯曲或切割应力集中在器件附近。
- 注意 DC 偏压影响：X7R 在施加接近额定电压时可能出现容量下降（典型范围 10%～40%，视规格与尺寸而异），在关键电路中应预留裕量或选择更高额定电压。
- 回流焊遵循 J-STD-020 无铅规范，峰值温度建议 ≤ 260°C 且短时加热；推荐使用适配 0201 的钢网开口（对超小器件通常采用 50%–70% 焊膏覆盖率以控制焊膏量）。
- 取放推荐使用真空吸笔并避免局部受力，贴装后避免板弯曲或强力擦拭。
五、可靠性与储存
- 村田此类汽车级产品经过更严格的可靠性测试，但实际设计仍需关注热循环、湿热、机械冲击与振动。
- 储存应防潮、防机械碰撞，建议在封装条件下按厂方建议的保质期内使用；开封后如需长期存放请回潮烘干处理。
六、选型与替代建议
选型时重点匹配：容值 2.2 nF、0201 尺寸、10 V 额定、X7R 介质与 ±10% 公差。若电压偏高或需更低温漂，可考虑 16 V 或 C0G/NP0 类型（但 C0G 在同尺寸下成本与可得性需确认）。可在村田、TDK、KEMET、太阳诱电等厂商中按上述参数交叉查找等效件，最终以厂方数据表和可靠性报告为准。
如需更详细的电容随温度/偏压的曲线、机械尺寸图或推荐 PCB 焊盘样式，可提供您要使用的 PCB 工艺与回流曲线，我可据此给出更具体的布局与工艺建议。
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