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muRata GJM0335C1H4R9BB01D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- mu Rata GJM0335C1H4R9BB01D
- Type
- MURATA
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GJM0335C1H4R9BB01D
- Electronic Component
- 1
- Electronic Component
- 4.9pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0263454258
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GJM0335C1H4R9BB01D 产品概述
一、产品简介
GJM0335C1H4R9BB01D 为村田（muRata）出品的贴片多层陶瓷电容（MLCC），标称容值 4.9 pF，额定电压 50 V，温度特性为 C0G（又称 NP0）。器件采用 0201 超小封装，适用于对温漂、频率稳定性和损耗有较高要求的小型化电路。
二、主要参数与电气特性
- 容值（C）：4.9 pF
- 额定电压（Vr）：50 V
- 温度系数：C0G（近似 0 ±30 ppm/°C，温度稳定性优良）
- 封装：0201（典型尺寸约 0.6 mm × 0.3 mm）
- 特性：低介质损耗、高 Q 值、极小的温度漂移与电压系数，适合高频与精密应用。
注：型号编码中含容差和制造信息，具体公差、绝缘电阻、耐压与环境等级请以厂商数据手册为准。
三、优势与典型应用场景
- 优势：C0G 材料使电容在宽温区间内保持极高稳定性，近似无电压依赖性且损耗极低；0201 小封装有利于高密度贴装与减小寄生。
- 典型应用：射频前端（滤波、匹配）、振荡器与定时电路、精密模拟信号路径、高速数字去耦与阻抗匹配等需稳定电容值的场合。
四、封装与装配注意事项
- 0201 体积极小，要求高精度贴装设备与适配的回流焊工艺。
- 推荐参考厂商给出的焊盘尺寸与回流曲线，避免过热或不充分湿润。
- 注意基板应力与弯曲对小型陶瓷件的影响，过大的机械应力会引起裂纹或失效，必要时在关键位置采取加固或改用更大封装。
- 装配与测试过程注意静电防护（ESD）。
五、选型建议与替代考虑
选择时除容值和电压外，请确认容差、温度与频率特性、寿命与可靠性指标（如焊接可靠性、机械强度）。如电路存在较大直流偏置或需更高容值/更高电压，可考虑更大尺寸或其他介质类型的型号。最终选型建议参照村田官方数据手册与样品验证结果。
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