Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM0335C1HR70WA01D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GRM0335C1HR70WA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1HR70WA01D
- Electronic Component
- 1
- Electronic Component
- 0.7pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0259012971
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1HR70WA01D 产品概述
1. 产品简介
GRM0335C1HR70WA01D 是 muRata（村田）公司生产的一款高性能多层陶瓷电容器（MLCC），适用于广泛的电子应用。该电容器采用先进的陶瓷材料和表面贴装技术，具有优异的电气性能和可靠性，特别适合在紧凑型电子设备中使用。
2. 主要参数
- 电容值: 0.7pF
- 容差: ±0.05pF
- 额定电压: 50V
- 温度系数: C0G，NP0
- 工作温度范围: -55°C ~ 125°C
- 应用: 通用
- 安装类型: 表面贴装
- 封装/外壳: 0201（0603 公制）
- 尺寸: 0.024" 长 x 0.012" 宽（0.60mm x 0.30mm）
- 厚度（最大值）: 0.013"（0.33mm）
3. 技术特点
- 高精度: 容差为±0.05pF，确保了电路中的精确电容值，适用于高精度要求的应用。
- 宽温度范围: 工作温度范围为-55°C ~ 125°C，能够在极端环境下稳定工作。
- 低损耗: 采用C0G（NP0）温度系数，具有极低的损耗和稳定的电容值，适用于高频和高稳定性要求的电路。
- 小型化设计: 封装尺寸为0201（0603 公制），体积小巧，适合高密度PCB布局，满足现代电子设备小型化的需求。
- 高可靠性: 采用多层陶瓷结构，具有良好的机械强度和电气性能，确保长期稳定运行。
4. 应用领域
GRM0335C1HR70WA01D 广泛应用于各种电子设备中，包括但不限于：
- 通信设备: 如手机、基站、无线模块等，用于滤波、耦合和旁路电路。
- 消费电子: 如平板电脑、笔记本电脑、数码相机等，用于电源管理和信号处理。
- 工业控制: 如PLC、传感器、自动化设备等，用于信号调理和滤波。
- 医疗设备: 如监护仪、诊断设备等，用于高精度信号处理。
- 汽车电子: 如车载娱乐系统、导航系统等，用于电源管理和信号处理。
5. 品牌与封装
- 品牌: muRata（村田）是全球领先的电子元器件制造商，以其高质量和可靠性著称。
- 封装: 0201（0603 公制）封装，适合高密度表面贴装应用，满足现代电子设备小型化和轻量化的需求。
6. 总结
GRM0335C1HR70WA01D 是一款高性能、高可靠性的多层陶瓷电容器，具有高精度、宽温度范围、低损耗和小型化设计等特点，适用于各种电子设备中的滤波、耦合和旁路电路。其优异的电气性能和可靠性，使其成为工程师在设计高精度和高稳定性电路时的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
