Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM1555C1H2R7BA01D是一款由日本村田(muRata)公司生产的表面贴装陶瓷电容器,属于多层陶瓷电容器(MLCC)系列。这款电容器的特点是极低的电容值(2.7pF)和高额定电压(50V),适用于多种电子产品和电路应用场景。其封装规格为0402(1005公制),使其极为适合有限空间内的布局设计。
电容值:2.7pF,适合高频和精密电路的应用,提供稳定的电容性能。
容差:±0.1pF确保在较小电容值变化下能够维持电路的稳定性。
额定电压:50V,意味着电容器能够在高压环境中正常工作,这使其在某些高功率应用中表现优越。
温度系数:C0G(NP0),表示该电容对于温度变化的敏感性极低,即使在-55°C到125°C的工作温度下,其电容值也几乎不发生变化。这是高精度应用,如射频电路和计量设备等的理想选择。
GRM1555C1H2R7BA01D的工作温度范围为-55°C至125°C,使得其在极端环境下仍能正常运行。这种广泛的温度适应性使其适用于航空航天、汽车电子和工业控制等需要高稳定性的场合。
这款电容器因其低电容和高精度的特点,广泛应用于射频电路、滤波器、振荡器、信号耦合、开关电源等高频和高稳定性的电路设计。其在信号处理、电源管理和高频通讯等领域的应用也越来越受到重视。
GRM1555C1H2R7BA01D采用0402(1.00mm x 0.50mm)的封装,厚度仅为0.55mm。超小的体积不仅可以帮助设计师节省电路板空间,还能显著降低电路的寄生电感。这种特性使得其能够在高速电路中实现理想的性能,减少信号失真和延迟。
**表面贴装技术(SMT)**的应用使得电容的组装过程更加自动化,从而提高生产效率。无铅设计符合RoHS标准,符合环保趋势。
GRM1555C1H2R7BA01D是一款性能卓越的多层陶瓷电容器,凭借其小巧的封装、稳定的电容量及耐高温、耐高压的特性,广泛应用于各种高频、高稳定性及高精度的电子电路。对于需要高性能和高可靠性的电子产品,选择GRM1555C1H2R7BA01D将是一个理想的决策。无论是在设计初期的选择中,还是在对设备进行升级时,这款电容器的表现都能超出预期,是现代电子产品中不可或缺的一部分。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products