WMSIC Electronic Components

muRata LQG15HS12NG02D

ModelLQG15HS12NG02D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

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Technical data

Product details

20 specifications

Core information

Product name
mu Rata LQG15HS12NG02D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LQG15HS12NG02D
Electronic Component
1
Package
0402
Electronic Component
SMD Inductor
Electronic Component
±2%
Electronic Component
0.015g
Inductor
12nH
Electronic Component
1
Factor
8@100MHz
Electronic Component
BM0257273217
Current
500mA
Frequency
3GHz
Resistor(DCR)
280mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LQG15HS12NG02D 产品概述

LQG15HS12NG02D 为村田(muRata)系列贴片电感,标称电感 12 nH,公差 ±2%,额定直流电流 500 mA,直流电阻(DCR)280 mΩ,品质因数 Q = 8(@100 MHz),自谐振频率(SRF)约 3 GHz,封装为 0402。该器件面向对体积、频率响应和温升有综合要求的小型射频与滤波电路。

一、核心参数(便于快速参考)

  • 品牌:muRata(村田)
  • 型号:LQG15HS12NG02D
  • 电感值:12 nH,精度 ±2%
  • 额定电流:500 mA
  • 直流电阻(DCR):0.28 Ω
  • 品质因数:Q = 8(测量点 100 MHz)
  • 自谐振频率:≈ 3 GHz
  • 封装:0402(贴片)

二、主要特性与电气性能解读

  • 中小电感值与高 SRF:12 nH 配合 ~3 GHz 的自谐振频率,表明器件在数百 MHz 甚至 GHz 级频段仍保持良好电感行为,适合射频匹配、谐振回路和高频滤波使用。但在接近或超过 SRF 时,器件呈现电容性,需避免在该频段作为纯电感使用。
  • DCR 与损耗:280 mΩ 的直流电阻在 500 mA 工作电流下的铜耗 P = I^2·R = 0.5^2 × 0.28 = 0.07 W(70 mW),属于小功率耗散,但在并联或多器件多次流经时需注意热管理与温升。
  • Q 值表现:Q=8(@100 MHz)表示在 100 MHz 附近有中等品质因数,适合在抗干扰和带内选择性要求不是极端苛刻的场合使用。若系统需要更高 Q 以降低损耗或提高选择性,应考虑更高 Q 的规格。

三、典型应用场景

  • 射频匹配网络(RF matching)、L/C 谐振回路、天线阻抗匹配
  • 高频滤波器、带通/带阻网络中的串联或并联电感
  • 射频偏置电源的直流阻隔与共模/差模抑制
  • 无线模块、手机、蓝牙/Wi‑Fi/IoT 终端等空间与频段受限的应用

四、选型与设计注意事项

  • 电流余量:推荐在系统设计时对额定电流做适当余量(常见建议不超过额定值的 70%–80%),以减少磁饱和与电感下降带来的影响。
  • 频率边界:工作频率应远低于 SRF(3 GHz),特别是在需要保持电感性行为的场合。若工作接近 GHz 级,应做电路仿真或实测验证。
  • 热与损耗:关注 I^2R 导致的局部发热。多器件并列或在高温环境下要验证温升与可靠性。
  • 封装限制:0402 尺寸决定了其机械强度与热容量有限,贴装时避免过力挤压和反复热循环。

五、PCB 布局与装配建议

  • 尽量缩短电感与相连器件之间的走线,减小寄生电感与阻抗不连续。
  • 对于射频用途,保持良好地平面与返回路径,减少地环路,必要时在近旁布置旁路电容形成稳定的匹配网络。
  • 采用常规贴片回流工艺,注意焊脚润湿与焊盘设计,避免对器件施加机械应力。清洗时选择对磁性材料安全的溶剂与工艺。

六、测量与验证建议

  • 电感值测量建议使用在目标频段附近的 LCR/网络分析仪,记录随频率变化的电感与 Q 值。
  • DCR 建议用四线测量,确保读数准确以便热损耗评估。
  • 在样机验证时做温升与 DC 偏置下的电感变化测试,以确认满足系统要求。

七、小结

LQG15HS12NG02D(村田,0402)以 12 nH、±2% 精度、500 mA 额定电流和 3 GHz SRF 的组合,适合微型射频匹配、滤波与偏置隔离等高频场景。选型时关注 DCR 导致的功耗、工作频率与 SRF 的边界以及装配与热管理事项,必要时通过仿真与实测验证电感在目标工作点的实际表现。

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