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muRata GJM0335C1H2R7BB01D
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GJM0335C1H2R7BB01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GJM0335C1H2R7BB01D
- Electronic Component
- 1
- Electronic Component
- 2.7pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0264889899
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GJM0335C1H2R7BB01D 产品概述
一、概述
GJM0335C1H2R7BB01D 为村田（muRata）生产的一款贴片多层陶瓷电容（MLCC），标称容量 2.7 pF，额定耐压 50 V，温度系数为 C0G（俗称 NP0），封装为 0201（约 0.6 × 0.3 mm）。该器件以极小的容量漂移、低损耗和优异的频率响应著称，适合对电容稳定性和寄生参数有严格要求的高频及精密电路场合。
二、主要特性
- 容量：2.7 pF，适用于微小容量需求的匹配与谐振电路。
- 额定电压：50 V，满足一般射频前端、小信号电路的偏压范围。
- 温度系数：C0G/NP0，温度稳定性好（典型 0 ±30 ppm/°C），在工作温度范围内几乎无电容漂移。
- 低介质损耗和低电感，适合高频应用，保持较高的自谐频率和优良的相位噪声特性。
- 超小封装 0201，有利于高密度 PCB 布局和自动化贴装。
三、典型应用
- 射频前端：匹配网络、调谐与滤波元件。
- 高频振荡与时钟电路：谐振电容、相位噪声要求高的场合。
- 精密模拟电路：采样、比较、差分和滤波电路中需要温度稳定性的场合。
- 便携与消费电子：手机、无线模块、蓝牙/Wi‑Fi 天线调试与匹配。
四、封装与工艺注意事项
- 封装 0201 属超小型，拾取与贴装建议使用精确的贴片设备与吸嘴，避免机械应力。
- 推荐采用无铅回流工艺（兼容最高焊接温度至 260°C 的典型回流曲线），遵循厂商回流温度曲线以保证焊接可靠性。
- 焊盘设计应避免过大应力集中，焊膏量与焊盘形状需按制造商建议优化，避免“tombstoning”或焊点裂纹。
- 对于 0201 元件，焊接后不建议做强烈的波峰或多次回流。
五、性能与可靠性
- C0G 材料提供极低的温度漂移与介电损耗，电容值受直流偏压影响极小，适合精密定值用途。
- MLCC 常见失效模式为机械破裂或端电极剥离，设计时应考虑 PCB 应力缓解与合理定位。
- 建议在使用前参阅村田的可靠性数据与加速寿命试验结果，以满足工业或车规等级要求（如需车规，请确认具体型号与认证）。
六、选型与采购建议
- 确认电路对容差、ESL/ESR、介质吸收等指标的具体要求，C0G 在温度与频率稳定性上优势明显，但容值范围偏小，不适合大容量需求。
- 在射频前端与精密时钟电路中优先考虑 C0G；若需更高电压或更大容量，考虑其他系列或更大封装。
- 采购时核对完整料号（GJM0335C1H2R7BB01D）以确保电气与封装一致性，向供应商索取最新规格书与封装图样以便设计验证。
若需，我可以为该型号补充详细的封装尺寸图、典型等效电路参数（ESL/ESR）、或在具体电路中如何布板与匹配的实例建议。
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