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muRata GRM0335C1H2R5CA01D
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GRM0335C1H2R5CA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H2R5CA01D
- Electronic Component
- 1
- Electronic Component
- 2.5pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0257359378
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1H2R5CA01D 产品概述
一、简要说明
GRM0335C1H2R5CA01D 为 muRata（村田）出品的多层陶瓷贴片电容（MLCC），封装为 0201（公制 0.6 × 0.3 mm）。额定电容值 2.5 pF，额定电压 50 V，介质材料为 C0G（又称 NP0），标称绝对公差 ±0.25 pF（相当于约 ±10%）。器件为 SMD 型，适用于高频与高稳定性场合。
二、电性能特点
- 极低的温度系数：C0G/NP0 介质电容随温度几乎不变，适合对温漂敏感的电路（定时、振荡、相位网络等）。
- 低介质损耗与低介电吸收：在高频工作时损耗小，保持较高 Q 值，有利于射频与滤波应用。
- 直流偏压敏感性很小：与 X7R、Y5V 等介质相比，C0G 在施加偏压时电容值变化非常小。
- 稳定性好：长期老化极小，适合精密模拟与射频前端使用。
三、典型应用
- 高频阻容网络、射频匹配与谐振回路
- 振荡器与相位锁定环（PLL）中的定容元件
- 高精度计时、采样电路与模拟前端（AD/DA）的参考网络
- 高频滤波器、耦合/去耦（小容值并联）与走线阻抗修正
四、封装与装配建议
- 0201 大小带来空间优势，但对贴装精度要求高：建议使用高精度点胶/印刷模板与高分辨率贴片机。
- 回流焊：遵循厂商的无铅回流曲线，避免急冷急热以减少陶瓷裂纹风险；留意焊膏印刷量与焊盘设计以防 tombstoning。
- PCB 焊盘设计：采用厂家推荐的 land pattern，可减少应力集中并保证焊接质量。
- 取放与检测：推荐使用真空吸嘴且为 0201 优化的吸嘴直径，X-ray 或自动光学检测（AOI）用于焊点检查。
五、可靠性与工艺注意事项
- 机械冲击与热应力：超小封装对机械应力敏感，过大的 PCB 弯曲或强力擦拭可能导致芯片破裂。
- 清洗与残留：若需清洗，选择对陶瓷和焊料兼容的清洗剂并保证充分干燥。
- 储存与搬运：避免长时间受潮或高温堆放，封装未开封时按厂家建议保存条件（干燥箱/防潮袋）处理。
- 电气使用：虽 C0G 对 DC 偏压影响小，但在高频/高电压场合仍建议验证实际电容值与寄生参数（ESL、ESR、SRF）。
六、选型建议与替代考虑
- 若电路对温度稳定性、线性度与低损耗有严格要求，GRM0335C1H2R5CA01D 是优先选型；若更关注体积或需要更低/更高电容值，可在同系规格中选取不同容值或外形。
- 对于需要更大容值但保留稳定性的场合，可考虑同厂 C0G 系列更大尺寸封装以降低封装引入的 ESL。
- 在量产前建议进行电压漂移、温度循环与振动测试以确认在具体工艺与应用下的可靠性。
如需本器件的封装图、推荐 land pattern、典型等效电路或厂家 Datasheet 链接，我可以为您查找并整理。
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