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muRata GRM1555C1H2R5CA01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GRM1555C1H2R5CA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM1555C1H2R5CA01D
- Electronic Component
- 1
- Electronic Component
- 2.5pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0257359894
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM1555C1H2R5CA01D 产品概述
一、产品简介
GRM1555C1H2R5CA01D 是 muRata（村田）出品的一款多层陶瓷电容（MLCC），封装为 0402（公制 1005），容值 2.5 pF，额定电压 50 VDC，温度系数为 C0G（NP0）。该型号面向对温度稳定性、线性度和损耗有严格要求的高频及精密电路应用，属于 SMD/SMT 表面贴装元件，适合高密度 PCB 组装。
二、主要技术参数
- 容值：2.5 pF
- 额定电压：50 VDC
- 温度系数：C0G（NP0），温度稳定性优异（典型 ±30 ppm/°C）
- 公差：0.25 pF（即 ±10%）
- 封装：0402（适用于自动贴装工艺）
- 结构：多层陶瓷（MLCC），介质损耗低、Q 值高
（注：详细测试条件、工作温度范围及电气特性请以厂商数据手册为准。）
三、核心特点与优势
- 温度稳定性高：C0G（NP0）介质在宽温区间内容量变化极小，适合对频率和相位稳定性敏感的电路。
- 损耗和非线性低：介质损耗（DF）低、介电吸收小，有利于维持高 Q 值，适合射频和高精度模拟应用。
- 小尺寸高密度：0402 封装适用于空间受限的现代电子产品和高密度贴装板。
- 良好的可靠性与一致性：村田作为知名厂商，产品批次一致性和制造过程控制严格，适合量产使用。
四、典型应用场景
- 射频匹配网络、滤波器与耦合电路（前端匹配、调谐网络）
- 振荡器、相位锁定回路（VCO、PLL）中对温度漂移敏感的定容元件
- 高频采样、模拟前端与时钟电路中的旁路/耦合元件（低寄生、低失真需求）
- 精密测量与计量设备中作为参考或稳定元件
五、封装与组装建议
- 采用常规回流焊工艺进行贴装，遵循厂家推荐的回流温升曲线以保障焊接可靠性。
- 0402 尺寸较小，贴装时需注意焊膏量与印刷模板设计，避免“桥连”或焊点不良。
- 采用合理的焊盘与贴装应力管理，避免 PCB 弯曲或过度热应力导致元件裂纹。
- 对于射频应用，注意布局中的走线阻抗与接地，尽量缩短连接路径以减小寄生电感。
六、选型与注意事项
- 容值极小（2.5 pF）时，电路中的寄生电容和布局影响可能与元件本身相当，布局与引线长度需优化。
- 虽然 C0G 对直流偏置敏感性小，但在高偏置电压下仍建议评估实际电路中容量变化，确保满足设计裕量。
- 对温度范围、寿命及环境可靠性（如潮湿、温循环）有严格要求时，请以 muRata 官方数据表与可靠性报告为准，并在样片阶段做实际验证。
如需器件的数据手册、封装尺寸图或采购替代型号（不同容值/电压或更小公差等），可提供具体需求，我可进一步协助对比与选型建议。
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