Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM0335C1H680JA01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM0335C1H680JA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H680JA01D
- Electronic Component
- 1
- Electronic Component
- 68pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0222169612
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：GRM0335C1H680JA01D 贴片电容
一、产品基本信息
GRM0335C1H680JA01D是村田（muRata）推出的一款高性能多层陶瓷电容（MLCC），它专为高频和高稳定性应用设计，具有极为优越的电气性能和可靠性。这款贴片电容广泛应用于电子设备中的各种电路，特别适用于需要小体积和高精度的场合。
二、主要规格
- 电容值: 68pF
- 容差: ±5%
- 额定电压: 50V
- 温度系数: C0G (NP0)
- 工作温度范围: -55°C 到 +125°C
- 封装尺寸: 0201（0.60mm x 0.30mm）
- 厚度: 最大 0.33mm
三、特性与优势
高稳定性: C0G（NP0）温度系数确保了电容在不同温度下的稳定性，能够很好地维持电容值，即使在严苛的环境条件下，电容的性能不会受到显著影响。
小型封装: 0201封装的优势在于其极小的体积，使其非常适合用于空间受限的应用场合。这在现代电子设备设计中尤为重要，尤其是在智能手机、便携式设备以及高密度PCB设计领域。
良好的频率特性: 这款MLCC电容在高频率操作下表现优良，是所有注重高频性能电路设计人员的理想选择，特别适用于射频电路和高速信号传输。
宽工作温度范围: 其工作温度范围从-55°C到+125°C，使得该电容能够在极端环境中稳定工作，适合航空航天、汽车和工业控制领域的应用。
高耐压和可靠性: 额定电压为50V，使得这款电容在高电压应用下也能稳定工作，适应多种电子组件和电路设计需求。
四、应用领域
GRM0335C1H680JA01D贴片电容广泛应用于以下领域：
消费电子: 智能手机、平板电脑、可穿戴设备等，确保信号传输的稳定性和设备的可靠性。
通信设备: 在无线通信设备、基站和信号处理单元中，关键的滤波和耦合应用需要高稳定性的电容器来优化性能。
工业控制: 用于传感器和控制电路中，确保设备在各种环境下的正常工作。
汽车电子: 在车载电子系统中，能够提供稳定的信号处理功能，适应高温和振动环境。
五、总结
GRM0335C1H680JA01D贴片电容以其卓越的特性和适应性，成为现代电子设计中不可或缺的组件。它不仅符合当前对小型化、高性能设备的需求，同时也在不同的应用领域展现了其多样的潜力。随着电子产品向更高频、更多功能和更小体积的发展，这种电容的应用前景将愈发广阔，值得设计师在新产品开发中积极考虑与应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
