Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
品牌: muRata(村田)
型号: LQP03TN0N9B02D
类型: 厚膜贴片电感
封装/外壳: 0201(0603 公制)
尺寸: 0.024" 长 x 0.012" 宽(0.60mm x 0.30mm)
高度 - 安装(最大值): 0.013"(0.33mm)
电感值: 0.9nH
容差: ±0.1nH
额定电流: 750mA
DC 电阻 (DCR): 100 毫欧最大
Q 值: 14 @ 500MHz
频率 - 自谐振: 18GHz
工作温度范围: -55°C ~ 125°C
电感频率 - 测试: 500MHz
屏蔽: 无屏蔽
材料 - 磁芯: 无磁性
安装类型: 表面贴装型
供应商器件封装: 0201(0603 公制)
LQP03TN0N9B02D 是 muRata(村田)公司生产的一款高性能厚膜贴片电感,采用 0201(0603 公制)封装,尺寸仅为 0.60mm x 0.30mm,高度最大为 0.33mm。这款电感具有极小的体积和优异的电气性能,适用于高密度电路板设计,尤其是在空间受限的应用场景中。
高精度电感值: LQP03TN0N9B02D 的电感值为 0.9nH,容差为 ±0.1nH,确保了电路设计的精确性和稳定性。
低直流电阻 (DCR): 最大直流电阻为 100 毫欧,有效减少了功率损耗,提高了电路的效率。
高 Q 值: 在 500MHz 频率下,Q 值达到 14,表明该电感在高频应用中具有较低的损耗和较高的能量存储能力。
高自谐振频率: 自谐振频率高达 18GHz,适用于高频电路设计,如射频 (RF) 和微波应用。
宽工作温度范围: 工作温度范围为 -55°C 至 125°C,确保在各种环境条件下都能稳定工作。
无磁芯设计: 采用无磁芯材料,避免了磁性材料在高频应用中的磁滞损耗和饱和问题。
无屏蔽设计: 无屏蔽设计使得电感在空间受限的应用中更加灵活,但需要注意电磁干扰 (EMI) 问题。
LQP03TN0N9B02D 适用于多种高频和高密度电路设计,包括但不限于:
空间优化: 由于采用 0201 封装,LQP03TN0N9B02D 非常适合高密度电路板设计,能够有效节省空间。
高频性能: 高自谐振频率和高 Q 值使得该电感在高频应用中表现出色,但需注意电路布局和布线以最小化寄生效应。
热管理: 虽然工作温度范围较宽,但在高电流应用中仍需考虑散热问题,以确保电感的长期可靠性。
电磁兼容性 (EMC): 无屏蔽设计可能带来电磁干扰问题,建议在设计中采取适当的屏蔽措施。
LQP03TN0N9B02D 是 muRata 公司推出的一款高性能厚膜贴片电感,具有高精度、低损耗、高频特性优异等特点,适用于多种高频和高密度电路设计。其极小的封装尺寸和优异的电气性能使其成为现代电子设备中不可或缺的元件之一。无论是在射频、微波还是高速数字电路中,LQP03TN0N9B02D 都能提供稳定可靠的性能,满足各种严苛的应用需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products