WMSIC Electronic Components

MICROCHIP 24LC64T-I/SN 24LC64T

Model24LC64T-I/SN
PackageSOIC-8
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MICROCHIP 24LC64T-I / SN
Type
MICROCHIP
Unit
Electronic Component
Minimum package
3300 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
24LC64T-I/SN
Electronic Component
1
Package
SOIC-8
Electronic Component
EEPROM
Electronic Component
0.169g
Electronic Component
1
Electronic Component
BM0000279729
Electronic Component
64Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
400kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MICROCHIP 24LC64T-I/SN

一、引言

MICROCHIP的24LC64T-I/SN是一款高性能的EEPROM(电可擦可编程只读存储器),采用I²C接口,适用于各种电子设备和系统的非易失性存储需求。这款器件以其64Kb(8K x 8字节)的存储能力,以及广泛的工作电压和温度范围,成为许多工业应用、消费电子和通信设备中的理想选择。

二、产品特性

  1. 存储技术及容量

    • 类型:非易失性EEPROM
    • 总容量:64Kb(等于8K x 8位),允许存储大量数据并在断电后保留内容。
  2. 接口与通讯

    • 通信接口:I²C(Inter-Integrated Circuit)
    • 时钟频率:设备最高支持400kHz的I²C时钟频率,确保系统内快速数据传输。
  3. 性能参数

    • 写入周期时间:字写入时间为5毫秒,页写入时间略有不同,适合对数据进行频繁的写入操作。
    • 访问时间:系统访问时间为900纳秒(ns),有助于提升数据读写效率,减少延迟。
  4. 电源与温度范围

    • 供电电压:支持2.5V至5.5V的宽电压输入范围,使其能够兼容多种电源环境。
    • 工作温度:适用温度范围为-40°C至85°C,确保在苛刻环境下的稳定运行,适合工业和户外应用。
  5. 封装与安装

    • 封装类型:8-SOIC封装,尺寸为0.154英寸(3.90mm宽),便于在面板电路中实现高密度布局。
    • 安装方式:表面贴装型(SMD),适合现代电子生产工艺,提高了组装效率。

三、应用场景

24LC64T-I/SN广泛应用于各种领域,包括但不限于:

  1. 消费电子产品:用于家庭电器、玩具、智能家居设备中存储配置数据和用户设置,确保设置在关机后保持不变。

  2. 工业设备:在自动化控制系统和传感器中,用于保存设备状态、校准数据及历史记录,便于后续的数据查询和分析。

  3. 医疗设备:用于患者监控设备和医疗仪器中,存储患者数据和使用记录,提高设备的智能化水平。

  4. 网络通讯:可以在路由器、交换机和其他通讯设备中存储网络配置信息,确保即使在重启之后也能迅速恢复工作状态。

四、竞争优势

  1. 高可靠性:非易失性设计确保存储的信息即使在断电时也不会丢失,极大提升了数据可靠性。

  2. 灵活的电源适应能力:宽电压输入设计使得器件能够在不同的电源条件下稳定工作,为设计提供了灵活性。

  3. 高温度适应性:广泛的工作温度范围保证了其在高温和低温条件下的有效运行,使其适用于多种工业和环境条件。

五、总结

MICROCHIP 24LC64T-I/SN是一款集成了高性能、广泛兼容性及高可靠性的EEPROM存储器,具有出色的I²C通讯能力和适应性,使其成为现代电子应用中不可或缺的元器件。无论是在工业控制、消费电子、医疗设备还是通讯领域,该器件都能满足用户对存储和数据管理的多样化需求,是设计工程师在产品开发时值得优先考虑的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.