Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MICROCHIP MCP6L01T-E/OT MCP6L01T
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MICROCHIP MCP6L01T-E / OT
- Type
- MICROCHIP
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MICROCHIP
- Electronic Component
- MCP6L01T-E/OT
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- Operational Amplifier
- Electronic Component
- 0.043g
- Electronic Component
- 1
- Electronic Component
- Output
- Electronic Component
- BM0000035469
- Operating Temperature
- 40℃~+125℃
- Amplifier
- 1
- Output Current
- 20mA
- (SR)
- 600V/ms
- Power Supply Voltage
- 1.8V~6V
- Static Current(Iq)
- 85uA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MCP6L01T-E/OT 产品概述
MCP6L01T-E/OT 是一款由美国微芯科技（Microchip Technology）制造的高性能通用运算放大器。它采用表面贴装型（SMD）封装，封装形式为 SOT-23-5，适用于各种空间受限的电子设备。该运算放大器设计用于宽泛的应用场景，包括信号调理、传感器接口以及数据采集系统。
主要特性
MCP6L01T-E/OT 的一些主要技术参数如下：
电路数: 该器件为单路运算放大器，便于在需要单一信号放大的应用中使用。
供电电压范围: 该运算放大器的供电电压范围为 1.8V 至 6V（单电源或双电源配置），使其在低功耗和高效能设计中表现良好。
极低的输入偏置电流: 输入偏置电流仅为 2pA，这使得它在高阻抗输出环境中表现优异，能够有效降低由输入偏置电流引入的误差。
功耗: 工作时的供电电流为 85µA，能够显著提高系统的能效，适合于便携设备和电池供电的应用。
高温工作范围: MCP6L01T-E/OT 的工作温度范围为 -40°C 至 125°C，确保其在严苛环境条件下的可靠性和稳定性。
增益带宽积: 该放大器具有 1MHz 的增益带宽积，允许用户在不牺牲信号处理速度的情况下，提高回路增益。
满摆幅输出: 输出类型为满摆幅，能够有效提升信号输出电平，满足多种应用需求。
压摆率: 该运算放大器的压摆率为 0.6V/µs，这对动态信号处理尤为重要，并能保证在快速变化信号下，仍然维持良好的增益特性。
输入补偿电压: 输入补偿电压约为 1mV，有效抑制了偏置误差，提升了传感器和测量系统的精度。
应用领域
MCP6L01T-E/OT 显著的性能特征使其适用于广泛的应用场景：
传感器信号调理: 与各类传感器（如温度传感器、压力传感器等）配合使用，可以有效提升信号强度与稳定性。
数据采集系统: 在数据采集系统中，MCP6L01T-E/OT 可用于进行信号放大，提高数据的可用性和准确性。
便携式设备: 由于其低功耗特性，这个运算放大器非常适用于便携式电子设备和电池供电的系统。
医疗设备: 适合于各种医疗仪器中，如心电图（ECG）仪器和其他生物信号监测设备，对输入信号的精确增强及噪声抑制十分有效。
总结
MCP6L01T-E/OT 运算放大器以 high-performance 通用运算放大器的地位在电子设计工程师中备受推崇。其低功耗、低输入偏置电流和宽广的供电电压范围，使其在各种应用中均能展现出色的性能。无论是工业电子、消费电子还是医疗仪器领域，MCP6L01T-E/OT 都提供了一种理想的解决方案。其灵活性和可靠性使其成为现代电子电路设计不可或缺的组件之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
