WMSIC Electronic Components

MICROCHIP MCP9700AT-E/TT MCP9700AT

MICROCHIP MCP9700AT-E/TT MCP9700AT
1 / 3

Product image

ModelMCP9700AT-E/TT
PackageSOT-23
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MCP9700AT-E / TT
Type
MICROCHIP
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
MCP9700AT-E/TT
Electronic Component
1
Package
SOT-23
Electronic Component
Temperature Sensor
Electronic Component
±2℃
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0000286053
Operating Voltage
2.3V~5.5V
Electronic Component
40℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：MCP9700AT-E/TT

一、引言

MCP9700AT-E/TT是由美国微芯科技（Microchip Technology Inc.）推出的一款高精度、低功耗的模拟温度传感器。它旨在满足工业、消费电子、汽车等多种领域对温度测量的严格要求，具备卓越的性能及极高的可靠性。其设计使其能够在宽广的温度范围内准确测量，并适应多种供电电压的需求，从而为用户提供灵活的应用选择。

二、基本参数

MCP9700AT-E/TT的主要参数如下所示：

  • 操作温度范围：-40°C至125°C，与局部感温范围一致，确保在极端环境下的稳定性。
  • 供应电压：支持2.3V至5.5V的广泛电压范围，使其能够兼容多种电源系统。
  • 输出类型：模拟电压输出，简化整体设计流程并与大多数微控制器的ADC接口兼容。
  • 精度：最高精度可达到±2°C（特定范围内为-2°C至+4°C），在实际应用中可提供可靠的数据。
  • 分辨率：具有10mV/°C的分辨率，对于不同热源条件下的调试和监测提供了充足的信息。
  • 封装类型：采用TO-236-3、SOT-23-3等小型表面贴装型封装，适合空间受限的应用场合。

三、应用场景

MCP9700AT-E/TT适用于多种行业，具体包括但不限于：

  1. 汽车电子：在车辆内部及外部环境监测方面其精确的温度数据能够为车载系统提供准确实时的反馈，保障安全和舒适性。

  2. 工业控制：适用于温度监测和过程控制，具有高温稳定性以满足工业环境下的需求。

  3. 消费电子：可用于温控设备、智能家居产品等，实现温度监测及控制，提高产品智能化程度。

  4. 医疗设备：在医疗检测设备中实时监控环境温度，确保设备的安全稳定运行。

四、工作原理

MCP9700AT-E/TT的工作原理基于热电偶或热敏电阻的技术。当设备周围的温度变化时，传感器内部的构件会产生相应的电压变化，进而通过模数转换实现温度的高精度测量。以10mV/°C的分辨率，用户可以轻松解读其输出信号，快速得到环境温度数据。

五、设计优势

  1. 高精度与可靠性：MCP9700AT-E/TT在广泛的操作温度下提供稳定的测量结果，降低了因温度波动导致的系统故障风险。

  2. 小型化和低功耗：小尺寸的SOT-23-3封装不仅使设备在设计上更为紧凑，也进一步提升了产品的效能，适合移动设备等低功耗要求的场合。

  3. 简便的设计与集成：基于单一的模拟输出，设计师可以轻松将该传感器集成至各种电子电路中，极大提升了设计的灵活性。

六、总结

MCP9700AT-E/TT是一款强大且灵活的温度传感器，适用于多种工业和消费电子应用。凭借其高精度、广温度范围、以及小型化的设计，它为温度监测解决方案提供了完美选项。选择MCP9700AT-E/TT，将为产品的性能和安全性打下坚实基础，助力您在激烈的市场竞争中脱颖而出。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.