WMSIC Electronic Components

MICROCHIP 11AA02E48T-I/TT 11AA02E48T

Model11AA02E48T-I/TT
PackageSOT-23-3
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP 11AA02E48T-I / TT
Type
MICROCHIP
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
11AA02E48T-I/TT
Electronic Component
1
Package
SOT-23-3
Electronic Component
EEPROM
Electronic Component
0.75g
Electronic Component
1
Features
Built-in Latch(WEL)
Electronic Component
BM0230072163
Electronic Component
2Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~5.5V
Interface Type
Bus
Electronic Component
100
Clock Frequency(fc)
100kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

11AA02E48T-I/TT 产品概述

一、产品简介

11AA02E48T-I/TT 是 MICROCHIP(美国微芯)推出的一款高可靠性、低功耗的 2Kbit 串行 EEPROM,采用单总线(单线)通信接口,工作电压范围宽(1.8V 至 5.5V),工作温度范围为 -40℃ 到 +85℃,封装为 SOT-23-3,适合空间受限且对数据长期保存有高要求的嵌入式系统与消费电子设备。

二、主要特性

  • 存储容量:2Kbit(2048 bit = 256 字节),适合小量配置信息、校准数据、序列号、固件参数等存储需求。
  • 接口类型:单总线(单线),减少片上引脚占用与 PCB 布线复杂度。
  • 电源电压:1.8V ~ 5.5V,兼容低压与 5V 系统。
  • 工作温度:-40℃ ~ +85℃,满足工业级温度要求。
  • 写周期寿命:100 万次,提供高耐久写入能力。
  • 数据保持(TDR):200 年(典型),适用于需长期保持信息的场景。
  • 写周期时间(Tw):典型 5 ms/次,便于系统评估写占用时间。
  • 封装:SOT-23-3,小型化封装利于空间受限器件设计。

三、电气与机械参数(要点)

  • 存储组织:总容量 2Kbit,按字节组织(256×8 或等效组织方式,详见数据手册)。
  • 引脚功能(SOT-23-3 典型):VCC(电源)、GND(地)、DATA(单线总线)。
  • 推荐旁路电容:VCC 接 0.1 μF 贴片陶瓷以抑制电源噪声与瞬态电流。
  • 工作电流与待机电流:视具体工作模式而定,产品数据手册给出典型值,便于功耗预算。

四、可靠性与使用寿命

该器件提供高达 100 万次的写循环寿命,配合 200 年的数据保持能力,适合用于需要长期可靠保存关键配置或身份信息的应用。系统设计时应注意减少不必要的写入(例如采用缓存、批量写入或写入次数计数与轮换策略),以最大化整体寿命。

五、典型应用场景

  • 工业控制器中的校准参数与设备配置保存;
  • 消费类电子设备的序列号与生产信息存储;
  • 无线传感节点、计量设备中低功耗身份与配置信息的保存;
  • 汽车电子对温度与电压要求适中的子系统(符合温度等级的前提下)。

六、设计与使用建议

  • 电源管理:确保 VCC 在稳压后再进行总线通信,避免上电瞬态导致通信错误。
  • 总线设计:单总线通常需要上拉电阻(阻值根据总线负载与接口规范选择),并考虑 ESD 保护与滤波以提高抗干扰能力。
  • 写入策略:结合 Tw = 5 ms 的写入延时,采用批量写或缓存机制以减少写入次数并避免阻塞关键任务。
  • PCB 布局:将旁路电容靠近 VCC 与 GND 引脚放置,信号线尽量短且避开强干扰源。
  • 环境可靠性:在严苛环境中建议留有余量并参考厂商可靠性测试与认证信息。

七、包装与选型注意

SOT-23-3 小封装便于空间受限设计,但需注意焊接工艺与热回流曲线以保证焊接可靠性。选型时请以 MICROCHIP 官方数据手册为准,确认引脚排列、总线时序、通信协议细节与寄存器/命令集,以便与系统 MCU 或主控正确对接。

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