Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MICROCHIP AT24C02D-STUM-T AT24C02D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MICROCHIP AT24C02D-STUM-T
- Type
- MICROCHIP
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MICROCHIP
- Electronic Component
- AT24C02D-STUM-T
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- EEPROM
- Electronic Component
- 0.043g
- Electronic Component
- 1
- Features
- Built-in positions(POR)
- Electronic Component
- BM69416260
- Electronic Component
- 2Kbit
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.7V~3.6V
- Interface Type
- I2C
- Electronic Component
- 100
- Clock Frequency(fc)
- 1MHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AT24C02D-STUM-T 产品概述
产品简介
AT24C02D-STUM-T 是一款基于 EEPROM 技术的非易失性存储器，具有 2Kb 的存储容量（256 x 8 位），由全球知名的半导体制造商 MICROCHIP（美国微芯）生产。该产品采用 SOT-23-5 表面贴装型封装，具有出色的性能和广泛的应用前景。其工作电压范围为 1.7V 至 3.6V，能够在严苛环境下稳定工作，温度范围达到 -40°C 至 +85°C。
主要特点
- 存储容量：AT24C02D-STUM-T 提供 2Kb 的 EEPROM 存储容量，适合存储小规模数据，例如配置参数、识别码等。
- 接口类型：采用 I²C 接口，使其能够与多种微控制器和数字芯片进行简单的串行通信。这一点减少了引脚数量，便于电路设计。
- 写入和读取性能：存储器的访问时间为 4.5µs，写周期时间为 5ms，确保数据的快速读取与存储，适用于对高速存储需求的场合。
- 工作电压范围：其供电电压范围为 1.7V 到 3.6V，使其可以在多个应用中灵活使用，尤其是在功耗受限的应用环境中。
- 工作温度范围：支持 -40°C 至 +85°C 的工作温度，使其适用于工业和汽车等要求极端环境的应用。
应用场景
AT24C02D-STUM-T 在多个行业及应用中都有广泛的使用，如：
- 消费电子：用于智能手表、家用电器等设备的配置信息存储。
- 工业控制：在自动化控制器中存储参数设置、识别信息和状态监控数据。
- 汽车电子：存储车辆配置、诊断信息和序列号等数据，可靠性高，耐环境能力强。
- 医疗设备：在便携式医疗仪器中记录关键的配置和用户数据。
- 通信设备：用于存储身份识别数据和网络配置。
技术优势
AT24C02D-STUM-T 的使用 I²C 接口使得其在多设备系统中的集成度更高，降低了系统设计的复杂性。与传统的并行接口的 EEPROM 相比，I²C 提供了更少的引脚需求，适合尺寸较小的电子设备。此外，非易失性存储特性保证了在断电情况下数据的持久性和可靠性，进一步增强了该产品在各种应用中的吸引力。
结论
AT24C02D-STUM-T 是一款功能强大且灵活性的 EEPROM 存储解决方案，适用于广泛的电子产品和应用。无论是在成本敏感型产品还是高可靠性应用中，它都可以提供出色的数据存储解决方案。凭借其可靠的性能和适应各种环境的能力，AT24C02D-STUM-T 继续为电子设计人员提供优质的选择。制定的高标准和严格的质量控制，使其在行业中享有良好的声誉。选择 AT24C02D-STUM-T，您将获得技术成熟、性能稳定的存储器件，为您的电子产品增添更大的竞争优势。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
