Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MCP23017T-E/SS是一款由美国微芯科技(MICROCHIP)生产的高性能I/O扩展器,广泛应用于各种嵌入式系统和电子设备中。其主要功能是通过I²C接口扩展用户微控制器的I/O引脚数量,从而满足复杂应用中对输入输出端口的需求。由于其高效的工作特性和广泛的工作范围,这款产品在多种应用场合都表现出色。
工作温度范围
MCP23017T-E/SS能够在-40°C至125°C的环境温度下稳定工作,使其适用于汽车电子、工业控制、医疗设备等要求高温稳定性的领域。
电流支持
该芯片的灌/拉输出电流可达25mA,允许连接多种LED、继电器等负载,具备良好的电流驱动能力。
接口与通信
MCP23017T-E/SS通过I²C接口进行通信,支持多主机模式,方便与多种微控制器及外设的连接。其时钟频率达1.7MHz,确保了高速数据传输和高效的工作频率。
I/O数量
该I/O扩展器提供16个通用输入输出引脚,有效扩展了嵌入式系统的I/O能力,满足复杂外设连接需求。
输出类型
采用推挽式输出设计,能够有效提高负载驱动能力,并降低功耗,提高系统整体效率。
中断功能
MCP23017T-E/SS内置中断输出功能,能够实时响应外部事件,适用于需要即时反馈的应用场合。
电源供电范围
本产品支持的供电电压范围为1.8V至5.5V,灵活适应不同的系统设计需求,使其在低功耗应用中尤为突出。
封装与安装
MCP23017T-E/SS采用28-SSOP封装,支持表面贴装技术(SMD),适合高密度电路板布局,方便在自动化生产中进行组装。
MCP23017T-E/SS由于其高性能和灵活性,广泛应用于多个领域,包括但不限于:
MCP23017T-E/SS是一款功能强大的I/O扩展器,凭借其宽广的工作温度、电流承载能力以及多种通信接口,能够适应各种复杂的应用需求。无论是在低功耗设备还是高效能的工业控制系统中,MCP23017T-E/SS都能为设计人员提供灵活且可靠的解决方案,是现代电子设计中不可或缺的元件之一。使用MCP23017T-E/SS,开发者可以更好地实现其年设计目标,并显著提升整机的功能性和可靠性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products