WMSIC Electronic Components

MICROCHIP MCP2515-I/SO MCP2515

ModelMCP2515-I/SO
PackageSOIC-18-300mil
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MICROCHIP MCP2515-I / SO
Type
SOIC-18-300MIL
Unit
Electronic Component
Minimum package
1680 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
MCP2515-I/SO
Electronic Component
1
Package
SOIC-18-300mil
Type
CANController
Electronic Component
CANController
Electronic Component
0.795g
Electronic Component
1
Features
Programmable positions;; Low Power
Electronic Component
BM69415759
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~5.5V
Operating Current
5mA
Data
1Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MCP2515-I/SO 产品概述

1. 引言

MCP2515-I/SO是由美国微芯科技(Microchip Technology Inc.)生产的一款高性价比CAN控制器。作为一种极具影响力的控制器,MCP2515具备多项关键功能,使其在现代电子系统中得到广泛应用。该芯片能够以高效的方式实现CAN(Controller Area Network)通信,适用于汽车电子、工业自动化、智能家居及其他需要可靠通信的场景。

2. 产品特性

  • 协议和标准:MCP2515-I/SO支持CAN 2.0A和2.0B协议,使其兼容性非常强,能够在现有的CAN网络中方便地集成和使用。
  • 接口:该控制器通过SPI接口与主控MCU或微处理器进行通信,SPI接口的选择大大简化了硬件设计,提高了数据传输速度。
  • 供电电压:MCP2515的供电电压范围为2.7V至5.5V,适应多种供电环境,兼容性强。
  • 功耗表现:在10mA的低功耗运行下,MCP2515保证了良好的电源管理,适合对能耗要求严格的设备应用。
  • 工作温度范围:该芯片支持-40°C至85°C的扩展工作温度,确保其在恶劣环境下的工作稳定性,适合汽车和工业应用。
  • 封装形式:采用18-SOIC封装,具有较小的占板面积,便于在设计紧凑的电路板中使用。

3. 应用领域

MCP2515-I/SO由于其优秀的兼容性与广泛的适用性,被广泛应用于多个行业和领域:

  • 汽车电子:在现代汽车中,CAN网络是连接各种控制模块的主要技术,MCP2515被广泛用于车载信息娱乐系统、引擎控制模块、安全气囊系统等。
  • 工业自动化:在工业环境中,MCP2515能够实现机器间的有效通信,促进工业设备的智能化和自动化,常用于PLC(可编程逻辑控制器)、传感器与执行器的网络连接。
  • 智能家居:在智能家居系统中,MCP2515可支持各类家居设备之间的高效通信,提升设备的互联互通能力。
  • 医疗设备:医疗设备需要高可靠性的通信方案,MCP2515能够确保数据传输的准确性和及时性,应用于医疗监测设备、治疗设备等。

4. 设计考虑

在设计基于MCP2515-I/SO的电子产品时,工程师需考虑到以下几个方面:

  • 布线设计:由于MCP2515需要连接CAN收发器和MCU,合理布局PCB上各个元件的位置至关重要,以降低信号干扰和信号衰减。
  • 抗干扰能力:在噪声干扰较大的环境中,设计时应增加必要的滤波器和抗干扰措施,以确保CAN通信的稳定性。
  • 电源管理:确保在各个工作模式下负载的电源稳定,避免在高频通信时因为供电不足造成的故障。

5. 结束语

MCP2515-I/SO作为一款性能稳定且功能强大的CAN控制器,凭借其低功耗、高兼容性和广泛的工作温度范围,在众多应用领域展示出了其卓越的性能。未来,随着物联网技术和智能化应用的不断发展,MCP2515-I/SO将继续为精密的通讯需求提供强有力的支持,为各类电子产品的发展贡献力量。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.