WMSIC Electronic Components

MICROCHIP PIC16LF1503T-I/SL PIC16LF1503T

ModelPIC16LF1503T-I/SL
PackageSOIC-14
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MICROCHIP PIC16LF1503T-I / SL
Type
MICROCHIP
Unit
Electronic Component
Minimum package
2600 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
PIC16LF1503T-I/SL
Electronic Component
1
Package
SOIC-14
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.2g
CPU
8 Bit
CPU
PIC
I / O
11
RAM
128Byte
Electronic Component
1
ADC
10bit
Features
positions; positions(POR); Programmable Gate; Built-in General Purpose
Electronic Component
BM0230085639

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PIC16LF1503T-I/SL 产品概述

一、产品概述

PIC16LF1503T-I/SL 是 Microchip 出品的一款低压 8 位单片机,面向低功耗、成本和尺寸受限的控制与采集应用。该器件基于 PIC 内核,最高主频 20 MHz,程序存储容量 3.5 KB(FLASH),片上 RAM 128 Byte,提供 11 个通用 I/O。器件集成 10-bit A/D 转换器和内置振荡器,工作电压范围 1.8V 至 3.6V,工作温度范围 -40°C 至 +85°C,封装为 SOIC-14,适合小型嵌入式系统与便携设备。

二、主要规格亮点

  • CPU:PIC 内核,8-bit,最高 20 MHz
  • 存储:3.5 KB FLASH 程序存储;128 Byte 数据 RAM
  • I/O:11 个通用数字 I/O 引脚
  • 模拟:10-bit ADC,适用于简单传感器采集
  • 时钟:内置振荡器,减少外部元件需求
  • 电源与温度:1.8V–3.6V 工作电压,-40°C–+85°C 商业/工业级温度
  • 封装:SOIC-14,便于 PCB 布局与批量生产

三、功能与外设

器件内置 10-bit A/D,可用于电压、温度或电池电量检测;丰富的 GPIO 可配置为数字输入/输出,有利于按键、LED、驱动小型继电器等。内置振荡器支持多档频率设置,能在不使用外部晶振的条件下运行,降低 BOM 成本并节省 PCB 空间。FLASH 存储支持在系统编程与固件升级。

四、电气与环境规范

该 MCU 支持 1.8V 至 3.6V 宽工作电压,适合锂电池(单节)与 3.3V 系统。-40°C 至 +85°C 的工作温度使其可应用于室内与部分室外工业环境。设计时建议在 Vdd 近端放置 0.1 µF 去耦电容,确保电源稳定,降低射频干扰与复位异常。

五、封装与引脚

SOIC-14 封装利于自动化贴装,适配常见 PCB 布线规则。11 路 I/O 提供基本的控制与采集接口,对于功能需求有限但性能要求可靠的应用尤为合适。器件支持 Microchip 标准的 ICSP(在电路板上在线编程)与 MPLAB 开发工具,便于调试与量产编程。

六、典型应用场景

  • 电池供电的传感器节点与便携测量仪表
  • 简单家电与智能家居控制模块(按键、指示灯、传感输入)
  • 工业小型控制器、状态监测与门禁系统
  • 教育与入门级 MCU 项目

七、设计注意事项与开发资源

在电源轨设计上应考虑复位与上电斜率,必要时加入复位电路或上电复位模块。内置振荡器虽省去外部晶振,但对高精度时序(如通讯协议)需进行校准或采用外部时钟。建议使用 Microchip 的 MPLAB X 和 XC8 编译器配合 ICD/PGM 编程器进行开发与在线烧录,参考官方数据手册以获取完整引脚配置、中断与外设寄存器说明。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.