Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PIC16LF1503T-I/SL 是 Microchip 出品的一款低压 8 位单片机,面向低功耗、成本和尺寸受限的控制与采集应用。该器件基于 PIC 内核,最高主频 20 MHz,程序存储容量 3.5 KB(FLASH),片上 RAM 128 Byte,提供 11 个通用 I/O。器件集成 10-bit A/D 转换器和内置振荡器,工作电压范围 1.8V 至 3.6V,工作温度范围 -40°C 至 +85°C,封装为 SOIC-14,适合小型嵌入式系统与便携设备。
器件内置 10-bit A/D,可用于电压、温度或电池电量检测;丰富的 GPIO 可配置为数字输入/输出,有利于按键、LED、驱动小型继电器等。内置振荡器支持多档频率设置,能在不使用外部晶振的条件下运行,降低 BOM 成本并节省 PCB 空间。FLASH 存储支持在系统编程与固件升级。
该 MCU 支持 1.8V 至 3.6V 宽工作电压,适合锂电池(单节)与 3.3V 系统。-40°C 至 +85°C 的工作温度使其可应用于室内与部分室外工业环境。设计时建议在 Vdd 近端放置 0.1 µF 去耦电容,确保电源稳定,降低射频干扰与复位异常。
SOIC-14 封装利于自动化贴装,适配常见 PCB 布线规则。11 路 I/O 提供基本的控制与采集接口,对于功能需求有限但性能要求可靠的应用尤为合适。器件支持 Microchip 标准的 ICSP(在电路板上在线编程)与 MPLAB 开发工具,便于调试与量产编程。
在电源轨设计上应考虑复位与上电斜率,必要时加入复位电路或上电复位模块。内置振荡器虽省去外部晶振,但对高精度时序(如通讯协议)需进行校准或采用外部时钟。建议使用 Microchip 的 MPLAB X 和 XC8 编译器配合 ICD/PGM 编程器进行开发与在线烧录,参考官方数据手册以获取完整引脚配置、中断与外设寄存器说明。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products